Global Wafer Level Packaging Inspection Systems Market 2014 – 2018: New research report at SandlerResearch.org. Call at +1 888 391 5441 to purchase this report OR send an email on [email protected] with your contact details.

Research analysts forecast the Global Wafer Level Packaging Inspection Systems market to grow at a CAGR of 1.54 percent over the period 2013-2018. One of the key factors contributing to this market growth is the rising demand for smartphones and tablets. The Global Wafer Level Packaging Inspection Systems market has also been witnessing the short replacement cycle of portable electronic devices. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market.

Research report, the Global Wafer Level Packaging Inspection Systems Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, Europe, and the ROW; it also covers the Global Wafer Level Packaging Inspection Systems market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

Complete report of 61 Pages is available @ http://www.sandlerresearch.org/global-wafer-level-packaging-inspection-systems-market-2014-2018.html

Key vendors dominating this space are Camtek Ltd., KLA-Tencor Corp., Rudolph Technologies Inc., and Topcon Technohouse Corp.
Other vendors mentioned in the report are Dainippon Screen Manufacturing Co. Ltd., GlobalFoundries Inc., Hitachi Ltd., Intel Corp., Nidec Tosok Corp., Samsung Semiconductor Inc., Semiconductor Manufacturing International Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Toray Engineering Co. Ltd., and United Microelectronics Corp.

Key questions answered in this report:
•What will the market size be in 2018 and what will the growth rate be?
•What are the key market trends?
•What is driving this market?
•What are the challenges to market growth?
•Who are the key vendors in this market space?
•What are the market opportunities and threats faced by the key vendors?
•What are the strengths and weaknesses of the key vendors?

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Commenting on the report, an analyst from the team that published this report said: “The short replacement cycle of portable electronic devices is a major trend witnessed in the Global Wafer-level Packaging Inspection Systems market. In the current scenario, portable electronic devices such as smartphones and tablets are becoming obsolete within a short period of time. The main reason for this is the quick succession of next-version models, which results in consumers replacing older versions of their devices with newer ones. At the present time, the duration of the replacement cycle period is 8-12 months, but it used to be much longer. Therefore, this reduction in the product replacement cycle is fostering the demand for semiconductor wafers for their use in newly launched devices.”

According to the report, the growth of the Global Wafer-level Packaging Inspection Systems market is driven by several factors, the most important of which is the rising demand for smartphones and tablets. One of the major reasons for the growing demand for these devices is their increasing adoption in emerging markets. This subsequently creates more demand for semiconductor wafers, thus driving the growth of the Global Wafer-level Packaging Inspection Systems market.

Further, the report states that one of the key challenges in the market is the cyclical nature of the Semiconductor industry. As a result of this, many wafer-level packaging inspection system manufacturers often experience fluctuating revenues, which in turn adversely affects their profitability.

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List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Global Wafer Level Packaging Inspection Systems Market 2013-2018 (US$ million)
Exhibit 3: Growth Rates for Global Wafer Level Packaging Inspection Systems Market 2006-2018
Exhibit 4: Global Wafer Level Packaging Inspection Systems Market by Geographical Segmentation 2013
Exhibit 5: Global Wafer Level Packaging Inspection Systems Market by Geographical Segmentation 2013-2018
Exhibit 6: Global Wafer Level Packaging Inspection Systems Market by Geographical Segmentation 2013-2018
Exhibit 7: Wafer Level Packaging Inspection Systems Market in the APAC Region 2013-2018 (US$ million)
Exhibit 8: Wafer Level Packaging Inspection Systems Market in North America 2013-2018 (US$ million)
Exhibit 9: Wafer Level Packaging Inspection Systems Market in Europe 2013-2018 (US$ million)
Exhibit 10: CAGR Comparison between Geographies 2013-2018
Exhibit 11: Wafer Level Packaging Inspection Systems Market in Taiwan 2013-2018 (US$ million)
Exhibit 12: Wafer Level Packaging Inspection Systems Market in South Korea 2013-2018 (US$ million)
Exhibit 13: Wafer Level Packaging Inspection Systems Market in the US 2013-2018 (US$ million)
Exhibit 14: CAGR Comparison between Key-leading Countries 2013-2018
Exhibit 15: Global Smartphones Market by Unit Shipment 2012-2018 (million units)
Exhibit 16: Global Tablet Computer Market by Unit Shipment 2012-2018 (million units)
Exhibit 17: Vendor Ranking in Global Wafer Level Packaging Inspection systems Market 2013
Exhibit 18: Business Segmentation of Rudolph Technologies Inc. by Revenue 2013
Exhibit 19: Business Segmentation of Rudolph Technologies Inc. by Revenue 2013
Exhibit 20: Business Segmentation of KLA-Tencor Corp. by Segments FY2013
Exhibit 21: Business Segmentation of KLA-Tencor Corp. by Type FY2013
Exhibit 22: Geographical Segmentation of KLA-Tencor Corp. FY2013

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