Market Snapshot

The global 3D semiconductor packaging market is expected to witness a CAGR of 16.25% during the forecast period (2018-2023) and surpass a valuation of USD 37,400 million. Demand for 3D semiconductor packaging is on the rise. This is primarily owing to several functional advantages of 3D semiconductor packaging market as compared to conventional alternatives. Moreover, rising preference for power-efficient solutions is making a positive impact on 3D semiconductor packaging market. It is highly advanced and helps in improving the performance of the circuit performance. Increased use in consumer electronics is partly boosting the adoption of 3D semiconductor packaging. At the same time, the growing miniaturization trend in electronics designing and manufacturing is creating new avenues for market players.

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Companies Covered

Amkor Technology Inc., Intel Corporation, Jiangsu Chengjiang Electronics Technology Co., Ltd., STMicroelectronics NV, Samsung Electronics Corporation Ltd., Advanced Semiconductor Engineering Inc., Silicon ware Precision Industries Co., Ltd., Xilinx Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and ams AG.

asm AG, Amkor Technology Inc, and Taiwan Semiconductor Manufacturing Co. Ltd, are among the top-notch companies operating in the global 3D semiconductor packaging market. asm AG is an Austria-based company that designs, manufactures, and develops sensors, sensor interfaces, power management devices, analog semiconductor devices, and wireless solutions. In 2017, the company invested ~USD 254 million in R&D.

Global 3D Semiconductor Packaging Market, By Region, 2018

There is a tremendous market opportunity for 3D Semiconductor Packaging Market owing to the increasing application of 3D semiconductor packaging. On a regional level, Asia-Pacific, led by China is expected to remain a highly attractive market for 3D semiconductor packaging market during the review period. In 2018, Asia-Pacific accounted for the largest market share in term of revenue and the trend is likely to continue over the next several years. Asia-Pacific 3D semiconductor packaging market is projected to increase at 18.9% CAGR during the forecast period. The market in the region is currently valued at more than USD 8,000 million. A strong presence of market players in the region has led to the faster development of 3D semiconductor packaging market technologies and widespread availability semiconductor products. Furthermore, state-backed initiatives and investments are creating an environment where such cutting-edge technologies can thrive. This also supports a strong R&D pipeline for the semiconductor industry.

The market in North America held the second position in 2017 with a valuation of USD 3,888.2 million. During the forecast period, North America 3D semiconductor packaging market is projected to exhibit a CAGR of 14.6%. Market’s growth in the region is driven the strong growth of electronics industry in countries such the US, Canada and Mexico. American consumers are leaning towards miniaturized electronic devices that are compact but do not compromise on power. In addition, rapid adoption of high-end electronic devices and rise of machine learning and artificial intelligence (AI) are other factors that are likely promote the

application of 3D packaging for various semiconductor components.

Market Segmentation

By Type – 3D SIP, 3D WLP, 3D SIC, and 3D IC.
By Packaging Method - Package on Package, Through Silicon via (TSV), Through Class Via (TGV) and Others.
By End User - Consumer Electronics, Telecommunication, Industrial, Automotive, Military and Aerospace, and Others.
Type Analysis

In 2017, the 3D SIP segment commanded 33.5% market share. During the forecast period, the segment is expected to surge at a robust CAGR of 15.0%. 3D SIP is primarily used in premium-grade products.

Packaging Method Analysis

In 2017, the through silicon via (TSV) segment stood at a market valuation of USD 6,372.0 million. In terms of revenue, the segment has made a significant contribution to the global 3D semiconductor packaging market. TSV contains high density and short connection hence it is preferred over package-on-package.

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End User Analysis

The consumer electronics segment holds the largest share of the market in terms of value. In addition, the segment is expected to witness a CAGR of 15.99% during the review period and reach a valuation is excess of USD 11,700 million by 2023. This primary owing to robust growth of the consumer electronics sector in recent years.

Key questions addressed by the report

Which applications / segments provides the maximum growth opportunity?
What are the emerging technologies and how it would disrupt the market?
Who are the key players dominating the market, followed by other prominent vendors and strategies adopted by them?
What was the market size and what would be the forecast in next few years?
Regional and country attractiveness: mid to long term outlook?
Market dynamics including trends, opportunities, drivers, challenges and how this would impact the market eco-system?
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