The high density interconnect  market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are growing demand for smart consumer electronics and wearable devices and increasing adoption of advanced electronics and safety measures in the automotive vertical.

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HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. HDI PCBs possess technical characteristics of extremely high density routing interconnections that make the high density of components possible. HDI PCBs are a perfect solution for shrinking the footprint of electronics technology, comprising the core components of consumer electronic devices such as laptop computers, tablets, smartphones, and even wearable technology such as fitness bands and virtual reality devices.

The HDI market for 10+ Layers HDI is expected to grow at the highest CAGR during the forecast period. This growth can be attributed to 10+ Layers HDIs being used in a wide range of devices, such as high-reliability automotive products, high-density mobile devices, and IoT modules. 10+ layers HDI offer benefits such as small size, lightweight construction, and enhanced flexibility.

The HDI market for the medical end-user segment is expected to grow at the highest CAGR during the forecast period. The range of HDI PCB applications in the medical industry is vast and ever-growing. HDI PCBs can be found in pacemakers, defibrillators and heart monitors, medical imaging systems, MRIs, CT scans, and ultrasonic equipment among others. HDI PCBs are also used in medical devices like body temperature monitors, blood glucose monitors, and electrical muscle stimulation equipment.

The market for wearable devices is expected to grow at the highest CAGR during the forecast period. HDI PCBs possess technical characteristics of extremely high-density routing interconnections and make the high density of components possible. These attributes contribute to the high-performance and lightweight of HDI boards that make them ideal for powering wearable devices.

The HDI market in APAC is expected to grow at the highest CAGR during the forecast period. This growth can be attributed to the increasing application of HDI in consumer electronics, automotive, and healthcare verticals in countries such as China, India, and South Korea. It is also due to the extension of telecommunications networks in China, Thailand, Malaysia, South Korea, India, and other developing countries in APAC.

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Opportunities for the growth of the market include rising demand for connected devices and the evolution of 5G technology. Many of the connected devices require PCBs that are small enough to fit into constricted spaces without compromising on performance. HDI PCB technology can ensure that the circuit boards powering IoT devices are sufficiently small and high-performance. HDI is rapidly emerging as a promising technology for designing advanced 5G devices since HDI PCBs support high-density attributes, and they allow buried routing within multi-layered highly-interconnected structures.

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