PSM Plasma Systems is global leader plasma technology for Semiconductor, PCB, LCD and Material industries.
We PSM Inc. has rich experience and excellent staffs who have developed and commercialized various highly evaluated optimized processing techniques and practical manufacturing systems which are related to Semiconductor & Display industry, PCB & FCCL industry and other polymer industries o ver 10 years in the Institute for Advanced Engineering.
The atmospheric pressure plasma technique is a new advanced plasma system, which can overcome the limit of existing low-pressure vacuum plasma technique. Plasma Surface Treatment Technology
This is indeed useful technique that is able to improve productivity and quality simultaneously not only for semiconductor/displays/electronic parts, but for low-temperature material industry such as polymer & plastic / FPCB & FCCL by a possible in-line process. We PSM Inc. are expanding and thriving based on the diverse world-leading essential patents of atmospheric pressure plasma techniques throughout the following four areas: semiconductor packaging/display dry cleaning/polymer materials, surface treatments /environmental system; furthermore, our technology has acquired a reputation in a wide range of areas.
Vacuum Plasma System:
The NPT-V01 plasma system is widely used for the surface cleaning and modification process of semiconductor packaging and material treating. The demand of smaller chip size and fine pattern bring about the critical issues of semiconductor packaging.
PSM NPT-V01 plasma system has been applied the treatment of semiconductor back-end process, die attach and wire bonding, molding, ball mount.
The NPT-V01 plasma system is widely used for the surface cleaning and modification process of semiconductor packaging and material treating. wet cleaning system supplier
The demand of smaller chip size and fine pattern bring about the critical issues of semiconductor packaging. PSM NPT-V01 plasma system has been applied the treatment of semiconductor back-end process, die attach and wire bonding, molding, ball mount.
The NPT-V01 plasma system provide optimized process recipe for various semiconductor processes. Reliable NPT-V01 system offers stable process and excellent uniformity using specially designed electrode, and also competitive system with easy operation and convenient maintenance.
System features:
• Provide optimized process recipes for various semiconductor and polymer treatment processes.
• Stable process using specially designed electrode with good process uniformity.
• Competitive system with easy operation and convenient maintenance