The global interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022.

The ecosystem of interposer and fan-out WLP market comprises a network of integrated circuit designers, raw material suppliers, foundries, and outsourced semiconductor assembly & testing services (OSATS) players, among others. The major companies operating in the market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group, (Taiwan), and Amkor Technology (U.S.). The prominent companies in the market include well-established, financially stable, and technically sound players that have been operating in the industry for several years and have diversified product portfolios, proprietary technologies, and strong distribution networks through collaborations and acquisitions.

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Report Scope:

By Packaging Technology:

Through-silicon vias (TSVs)
Interposers
Fan-out wafer-level packaging (FOWLP)

By Application:

Logic
Imaging & optoelectronics
Memory
MEMS/sensors
LED
Power, analog & mixed signal, RF, photonics

By End-User Industry:

Consumer electronics
Telecommunication
Industrial sector
Automotive
Military and aerospace
Smart technologies
Medical devices

Geography:

APAC
North America
Europe
RoW

Through-silicon Vias (TSVs) held the largest size of the interposer and fan-out WLP market in 2015

TSV is one of the most compact package types with increased functionality. TSV has gained popularity in space-constrained mobile applications and is used in portable consumer devices as well as industrial products as it is a cost-effective, compact, lightweight, and high-performing semiconductor. The rising demand for advanced memory packages such as flash and hybrid memory, image sensors, and others in the consumer electronics industry is driving the growth of this market.

The market for memory applications to grow at the highest rate between 2016 and 2022

The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

APAC accounted for the largest share of the interposer and fan-out WLP market in 2015

The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

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