California, United States– Nisene Technology Group, a renowned leader in semiconductor failure analysis solutions and Decapsulation machines, proudly introduces the PlasmaEtch decapsulation system. This game-changing innovation bridges the gap between semiconductor manufacturing technology and failure analysis.
With its patented gas-based semiconductor etching system (US patent number 9,548,227), the PlasmaEtch opens new doors for efficient and environmentally friendly decapsulation processes.

The representative at the firm stated, “We are delighted to offer PlasmaEtch Decapsulation systems.”

The PlasmaEtch decapsulation system sets a new standard in the industry by employing an unprecedented application of microwaved gasses to incite chemical radicals for isotropic etching. This technology enhances the efficiency of semiconductor failure analysis. It contributes to a greener and more cost-effective semiconductor manufacturing process. This milestone reinforces Nisene Technology Group’s commitment to pushing the boundaries of semiconductor analysis.

This comprises Microwave-Induced Plasma (MIP) etching, a groundbreaking approach that revolutionizes decapsulation in semiconductor analysis. The MIP process utilizes the power of microwave radiation to create plasma, which is used for the precise etching of semiconductor samples.

The PlasmaEtch’s MIP etching can accommodate various sample sizes, encapsulant types, and wire bond types. The PlasmaEtch ensures safe and reliable etching across multiple materials, such as traditional gold wire samples and copper on silver wires.

Another significant feature is the afterburner downstream-focused plasma etching, which guarantees precise and controlled etching processes, ensuring the utmost accuracy in failure analysis. Moreover, the system offers mass flow control for all gasses involved in the etching process, enabling precise manipulation of the etch rate and process parameters.

The PlasmaEtch addresses safety concerns by ensuring that semiconductor samples are not exposed to harmful microwave radiation during the etching process, guaranteeing the integrity of the samples. Additionally, the system’s low-temperature etching capability allows delicate samples to undergo decapsulation without compromising their structural integrity.

The representative added, “By incorporating MIP etching and offering a safer and more sustainable solution, we aim to empower semiconductor manufacturers and failure analysis laboratories to achieve unprecedented results.”

With the PlasmaEtch system, they have once again demonstrated their commitment to pushing the boundaries of technology, ensuring that their clients have access to the most advanced tools for semiconductor analysis.

For more information visit us : https://www.nisene.com/products/plasmaetch/

About Nisene Technology Group

Nisene Technology Group is a leading semiconductor failure analysis equipment and services provider. With a focus on innovation, precision, and reliability, Nisene Technology Group empowers semiconductor manufacturers and failure analysis laboratories to overcome complex challenges and achieve breakthroughs in semiconductor analysis.

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