Nisene Technology Group Offers JetEtch Pro As The Next-Generation Automated Decapsulation System


Posted November 23, 2023 by nisene

The renowned firm offers information about next-generation automated decapsulation systems.

 
California, United States- Nisene Technology Group, a leading innovator in the semiconductor industry, proudly introduces the JetEtch Pro, the latest addition to their esteemed line of decapsulation systems. Building on their legacy, the team at the firm offers advanced systems for the decapsulation of electronic components.

The representative stated, “We are delighted to offer our customers the next-generation automated decapsulation system.”

The JetEtch Pro features a patented pump system that ensures precise and consistent chemical delivery, minimizing waste and optimizing decapsulation. A robust heat exchanger maintains temperature stability throughout decapsulation, resulting in consistent and reliable outcomes. Nisene’s commitment to safety is evident in the JetEtch Pro, which includes advanced safety mechanisms to protect operators and equipment.

Equipped with cutting-edge software, the JetEtch Pro offers enhanced control, process monitoring, and data analysis capabilities, making it easier than ever to achieve desired results. Designed with user convenience, the JetEtch Pro simplifies operation while maintaining its industry-leading performance. Leveraging the latest technological advancements, the JetEtch Pro delivers unmatched precision and efficiency in decapsulation.

Nisene stands behind the quality and durability of the JetEtch Pro with an industry-leading warranty, providing customers with peace of mind.

The JetEtch Pro builds upon the legacy of the JetEtch system, which has been a cornerstone of the industry for over three decades. With extensive enhancements to its internal components, the JetEtch Pro redefines excellence in decapsulation technology.

The JetEtch Pro performs a critical function in the semiconductor industry by decapsulating integrated circuits encased in mold compounds. This process, often called “decapping” or “Jet-Etching,” involves the removal of mold compounds using a user-specified chemical solution. The results of this process find applications in semiconductor failure analysis and counterfeit protection during product verification.
Without exposing the integrated circuit’s die, authenticating a component becomes nearly impossible. Furthermore, die exposure is paramount in failure analysis, enabling a wide range of essential tests.

The representative added, “The JetEtch Pro is a testament to Nisene’s commitment to innovation.”

Nisene is committed to providing its customers with cutting-edge solutions. The JetEtch Pro represents their unwavering dedication to delivering products that set new standards in the industry.

For more information visit us : https://www.nisene.com/products/jetetch-pro/

About Nisene Technology Group

Nisene Technology Group is a recognized leader in decapsulation and delayering equipment for the semiconductor industry. With a legacy of over 30 years, they have consistently delivered innovative solutions that enable their customers to meet their most demanding challenges. Their commitment to quality drives their pursuit of excellence.

Media Contact

Contact: (831) 761-7980

Address: 417-A Salinas Road
Watsonville, CA, 95076
United States of America
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Issued By Nisene Technology Group, Inc
Business Address 417-A Salinas Road Watsonville, CA
Country United States
Categories Business , Industry , Services
Tags decapsulation of electronic components , jet etch , jet etcher
Last Updated November 23, 2023