Albany, New York, April 6, 2017: The rapid increase in the demand of portable communication devices like smartphones, memory cards, smart card and other computing devices has significantly boosted the global market for thin wafer processing and dicing equipment. Considering this scenario, Market Research Reports Search Engine (MRRSE) has recently announced the addition of a new research report to its massive online collection. This research report is titled as “Global Thin Wafer Processing and Dicing Equipment Market- Industry Analysis, Trend, Share, Size and Forecast 2017-2024”. The report provides an exhaustive insight into the current state and future prospect of this industry.

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According to the report, the global market for thin wafer processing and dicing equipment is likely to grow at a CAGR of 6.8% between 2017 and 2024. Growing at this pace, the market evaluation will reach a value of US$692.5 million by the end of 2024 from US$388.9 million in 2015. The report provides an assessment of market drivers that are effecting the global market, along with the restraints, risks and opportunities which are likely to affect the demand in the forthcoming years. It also includes Porter’s five forces analysis for a better understanding of the level of competition that exist within the industry. Moreover, the market attractiveness study has been included for analyzing the overall scenario of the market.

For the purpose of providing a comprehensive analysis of the global market, the market has been segmented on the basis of application, dicing technology, wafer size and geography. On the basis of application, the market is divided into the following:

Logic and Memory
MEMS (Micro Electro Mechanical Systems)
Power Device
RFID (Radio Frequency Identification)
CMOS Image Sensor
Moreover, the segments based on dicing technology are blade dicing, laser dicing and plasma dicing. Geographically, the major regional markets are North America, Europe, Asia Pacific, Middle East and Africa and Latin America. Asia Pacific dominates the global market with a share of 64.2% and it is likely to remain dominant over the coming years. Information relating to the current market state with a forecast of market value and revenue for the period of 2017-2024 have been provided in the study for each regional segment.

Browse Full Report with TOC :http://www.mrrse.com/thin-wafer-processing-dicing-equipment-market

The major companies operating in the wafer processing and dicing equipment market are Disco Corporation (Japan), Plasma Therm  LLC (USA), Tokyo Electron Ltd (Japan)and EV Group (Austria)among others. These companies have been profiled in terms of aspects such as company details (HQ, foundation year and employee strength), market presence (by segment & by geography), business strategies, financial overview, SWOT analysis and major recent developments.

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