According to the latest report published by Variant Market Research, the global Flip Chip Technologies market size was valued at $26.5 billion in 2016, and is estimated to reach $54 billion by 2024. In this report, the global flip chip technologies market forecast says that the global market is growing at a CAGR of 9.3% from 2016 to 2024.

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The global flip chip technologies market is primarily driven by high demand for miniaturization

Imminent need of circuit miniaturization, high performing electronics devices, and high demand for mobile-wireless, computing, and consumer applications are some of the factors driving the growth of the global flip chip technologies market. In addition, enhanced performance capabilities of these technology have also supported the market growth. However, low customization options is the major hindrance for the growth of the market. Furthermore, increasing popularity of sensors in electronic devices like smartphone, laptops etc. are likely to gain significant impetus for the market over the forecast timeframe.

Market Segmentation
The global flip chip technologies market has been classified on the basis of packaging type, packaging technology, bumping technology, industry vertical and geography. On the basis of packaging type the segment includes wafer level packaging–CSPnl, flip chip LGA package, flip chip SiP package, flip chip BGA package, and lip chip PGA package. The classification by packaging technology consists of 2D IC, 2.5D IC, and 3D IC. The bumping technology segment is bifurcated into gold bumping, copper pillar, solder bumping (tin-lead eutectic solder and lead-free solder), and other bumping technologies (aluminum & conductive polymers). Aerospace and defence, automotive & transport, industrial, IT & telecommunication, electronics, healthcare, and other industry verticals (media, entertainment and renewable energy) are covered under the industry vertical segments.
Geographically, the market has been bifurcated into North America, Europe, Asia-Pacific, and RoW. North America (U.S., Mexico, and Canada), Europe (Germany, Italy, France, and Rest of Europe), Asia-Pacific (Japan, Taiwan, China, India, South Korea, and Rest of Asia-Pacific) and RoW (Middle East, South America, and Africa) are the key geographical regions included in this market.

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2.5D IC, by packaging technology accounted for the largest market share in 2016
2.5D IC led the packaging technology segment in 2016, with major market share, and is anticipated to continue its trend in the given forecast period. The high growth is attributed to the benefits such as enhanced capacity, improved performance, low power consumption, & compact system space requirements.

Copper pillar dominated the bumping technology segment with major share in the bumping technology segment

Copper pillar, by bumping technology held for the biggest market share in the year 2016. Also copper pillar is likely to continue its trend throughout the forecast timeframe 2016 – 2024, driven by its advantages such as and noticeably low cost than other methods, and high efficiency & compatibility with bond pads.

Electronics, by industry vertical held for the major market share in the year 2016
Electronics is the largest revenue generating sub-segment in the industry vertical segment in the year 2016 and is likely to continue its supremacy over the forecast period. The growth is credited to high adoption of tablets & smartphones among the consumer electronics devices.

Asia-Pacific occupied the largest share in the global flip chip technologies market in 2016
Asia-Pacific became the highest revenue generating region in the global market with majority of the share of 49.32% in the year 2016. The region is also anticipated to continue its trend in the forecast period, driven by booming market for semiconductors & electronic devices in this region.

Competitive Landscape
Key players profiled in the market include Intel Corporation, Siliconware Precision Industries Co., Ltd.,ASE group, Powertech Technology Inc., Samsung Electronics Co., United Microelectronics Corporation, Jiangsu Changjiang Electronics Technology Co., Texas Instruments, Inc., Amkor Technology, Inc., and TSMC, Ltd., among others.

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Scope of Flip Chip Technologies Market
Bumping Technology Segments
• Copper Pillar
• Solder Bumping
• Tin-lead eutectic solder
• Lead-free solder
• Gold Bumping
• Other Bumping Technologies (Aluminum & Conductive polymer)

Packaging Technology Segments
• 3D IC
• 2.5D IC
• 2D IC

Packaging Type Segments
• Flip Chip SiP Package
• Flip Chip PGA Package
• Flip Chip BGA Package
• Flip Chip LGA Package
• Wafer Level Packaging–CSPnl

Industry Vertical Segments
• Electronics
• Industrial
• Automotive &Transport
• Healthcare
• IT & telecommunication
• Aerospace and Defence
• Other Industry Verticals (Renewable Energy and Media & Entertainment)

Geographical Segments
• North America
o U.S.
o Canada
o Mexico

• Europe
o Germany
o France
o Italy
o Rest of Europe

• Asia-Pacific
o China
o Japan
o South Korea
o Taiwan
o India
o Rest of Asia-Pacific

• RoW
o South America
o Middle East
o Africa

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