3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2014 – 2020

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The report covers forecast and analysis for the 3D IC market on a global and regional level. The study provides historic data of 2014 along with a forecast from 2015 to 2020 based on revenue (USD million). The study includes drivers and restraints for the 3D IC market along with the impact they have on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the 3D IC market on a global level.

In order to give the users of this report a comprehensive view on the 3D IC market, we have included a detailed value chain analysis. To understand the competitive landscape in the market, an analysis of Porter’s Five Forces model for the 3D IC market has also been included. The study encompasses a market attractiveness analysis, wherein application segments are benchmarked based on their market size, growth rate and general attractiveness.

The study provides a decisive view on the 3D IC market by segmenting the market based on applications. All the application segments have been analyzed based on present and future trends and the market is estimated from 2014 to 2020. Key product market covered under this study includes LED, memories, MEMS, sensor, logic and others. Key product segments covered under this study includes LED, memories, MEMS, sensor, logic and others. Different substrate segments covered under this study includes silicon on insulator and bulk silicon. Major fabrication process segments covered under this study includes silicon epitaxial growth, beam re-crystallization, solid phase crystallization and wafer bonding. Some of the prime application segments covered under this study includes information and communication technology, military, consumer electronics and others applications. The regional segmentation includes the current and forecast demand for North America, Europe, Asia Pacific, Latin America and Middle East & Africa. This segmentation includes demand for 3D IC based on individual applications in all the regions.

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The report also includes detailed profiles of end players such as 3M Company, Tezzaron Semiconductor Corporation, United Microelectronics Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, STMicroelectronics and amongst others. The detailed description of players includes parameters such as company overview, financial overview, business strategies and recent developments of the company.

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