Integrated Microwave Assembly Market Soars to $2.0 Billion by 2027: Driven by Technological Advancements


Posted July 25, 2023 by avinashgogawale14

The Integrated Microwave Assembly Market is anticipated to develop at a 6.8% CAGR from USD 1.5 billion in 2022 to USD 2.0 billion by 2027.

 
The Integrated Microwave Assembly Market is anticipated to increase rapidly, from USD 1.5 billion in 2022 to USD 2.0 billion by 2027, at a compound annual growth rate (CAGR) of 6.8%.

The development of wireless communication technologies, the rising need for high-speed data connectivity, and the expanding use of microwave-based radar systems in aerospace and defence applications are all contributing reasons to the market's growth. Because of their efficiency, compactness, and enhanced performance, integrated microwave assemblies continue to be used in a variety of industries. As a result, the market is expected to present considerable potential for producers and suppliers to meet the changing demands of various industries.

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A number of reasons are expected to drive strong growth in the integrated microwave assembly market. One of the main factors is the rise in global defence spending, which encourages the development of sophisticated weapons systems and the need for military radars and secure communication devices. A rise in demand for integrated microwave assembly-based RF modules has also been caused by the quick deployment of 5G and technological breakthroughs, creating attractive prospects for market participants. The market is anticipated to have considerable growth in the upcoming years as industries continue to prioritise high-performance communication solutions.

Major players in the Integrated Microwave Assembly Market have primarily adopted partnership and contract strategies to strengthen their position in the market.

In January 2022, CAES has collaborated with Lattice Semiconductor to provide radiation-tolerant field-programmable gate arrays (FPGAs) for distributed satellite computing applications.
In October 2021, CAES received a contract from Lockheed Martin to provide Antenna Array Panel Assemblies to the US Navy’s Surface Electronic Warfare Improvement Program (SEWIP) Block2, which will improve the AN/SLQ 32 electronic warfare system’s support capability.
Analog Devices (US) and Teledyne Technologies (US) are major players in Integrated Microwave Assembly Market.

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Analog Devices (US)

A well-known American manufacturer of analogue technology is called Analogue Devices. Their areas of specialisation include the design, production, and marketing of several integrated circuits (ICs), algorithms, programmes, and subsystems. Sensors, data converters, amplifiers, linear products, radio frequency (RF) ICs, power management products, and other signal processing solutions are all part of their product line. Analogue Devices is a major player in the analogue technology sector, providing a wide range of cutting-edge products to a number of different industries.

Teledyne Technologies (US)

A leading provider of instrumentation, computerised imaging, aviation gear, and engineering systems, Teledyne Technologies is headquartered in the US. In addition to computerised imaging sensors, cameras, and systems utilised in the infrared and X-ray spectra, their product line also includes integrated microwave assemblies through their Teledyne Defence Electronics business unit. Teledyne Technologies supports a wide range of industries, including aerospace & defence, industrial automation, electronics, and communications, and offers cutting-edge solutions to address the unique requirements of each industry.

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Last Updated July 25, 2023