The report "Bonding Films Market by Type (Epoxy, Acrylic, Polyurethane), Technology (Thermally Cured, Pressure Cured), End-Use Industry (Electrical & Electronics, Transportation, Packaging), Region - Global Forecast to 2022", The bonding films market was valued at USD 613.5 Million in 2016 and is projected to reach USD 985.5 Million by 2022, at a CAGR of 8.2% between 2017 and 2022.

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Some of the key players operating in the bonding films market are Henkel AG & Co. KGaA (Germany), 3M (US), Cytec Solvay Group (Belgium), Hitachi Chemical Co., Ltd. (Japan), Arkema S.A. (France), H.B. Fuller (US), Hexcel Corporation (US), Gurit (Switzerland), DuPont (US), and Rogers Corporation (US). The competition among these players is high, and they mostly compete with each other on the prices and quality of the products, their product portfolios, after sale services, customized solutions, etc.

The target audiences for the bonding films market report are as follows:

Manufacturers of Bonding Films
Suppliers of Bonding Films
Raw Material Suppliers
Service Providers
Electrical & Electronics, Transportation, and Packaging End-use Industries
Government Bodies
Bonding Films Market, by Type:

The bonding films market has been segmented on the basis of the type into:

Epoxy
Acrylic
Polyurethane
Others (Polyvinyl Acetate (PVA), Polyvinyl Butyral (PVB), Ethylene-vinyl Acetate (EVA), and phenolic)
Bonding Films Market, by Technology:

The bonding films market has been segmented on the basis of the technology into:

Thermally Cured
Pressure Cured
Others (Chemically Cured and Light cured)
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Among types, the epoxy segment of the bonding films market is projected to grow at the highest CAGR during the forecast period from 2017 to 2022.

Based on the type, the bonding films market has been segmented into epoxy, acrylic, polyurethane, and others. Among types, the epoxy segment accounted for the largest share of the bonding films market in 2016. This segment of the market is projected to grow at the highest CAGR during the forecast period. The increased use of epoxy bonding films in various end-use industries can be attributed to their high compatibility with various bonding substrates. Moreover, epoxy bonding films are easy to handle, exhibit minimum squeeze out, and offer effective performance when exposed to a range of temperatures and tough environmental conditions.

The electrical & electronics end-use industry segment of the bonding films market is projected to grow at the highest CAGR between 2017 and 2022.

The electrical & electronics end-use industry segment accounted for the largest share of the bonding films market in 2016. Bonding films are extensively used in high-end defense & aerospace, automotive, industrial, and consumer electronics applications. The bonding films that are manufactured for use in the electrical & electronics industry are supplied in the form of rolls, sheets, or pre-cut forms. They are also die attached, which enables them to attain desired shape and characteristics. In the transportation end-use industry, bonding films are used in composite-to-composite, metal-to-metal, and composite-to-metal bonding applications.

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