The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology by connecting the multiple memory arrays to the top of one another. It uses standard DRAM cells for memory implementation. The High-bandwidth Memory (HBM) is also the RAM interface but for 3D stacked SDRAM. It is used in combination with network devices and graphic accelerators. Both memory bus is capable of providing higher bandwidth with lower power consumption. It is widely applicable in graphics designing, in the field of networking, and others.
Major factors driving the growth of the HMC and HBM market include the growing need for high-bandwidth, low power consuming, and highly scalable memories, increasing adoption of artificial intelligence, and rising trend of miniaturization of electronic devices.
Key Market Players
Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), Advanced Micro Devices (AMD) (US), Xilinx (US), Fujitsu (Japan), NVIDIA (US), IBM (US), Open-Silicon, Inc. (US)

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By product type, the market for APU to grow at the highest CAGR during the forecast period.
The market for APUs is expected to grow at the highest rate during the forecast period. HBM-based APUs are a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.

By Application, HMC and HBM market for graphics applications to grow at the highest CAGR during the forecast period
The HMC and HBM market for graphics applications is expected to grow at the highest CAGR during the forecast period. A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that is increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process vast amounts of pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.
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Market Dynamics
Driver: Growing need for high-bandwidth, low power consuming, and highly scalable memories
The development of various 3D-stacked memories is mainly driven by the rising need for memories offering high bandwidth, low power consumption, and high scalability. With the emergence of Big Data, the Internet of Things (IoT), and other data-intensive applications, there is a growing demand for technologies that can efficiently process and store more information. Also, there is a strong need for memories with high efficiency and performance in the network system for data packet buffering, data packet processing, and storage applications beyond 100 Gbps. HMC and HBM, which provide a bandwidth of more than 100 Gbps, can be a feasible replacement for DRAM as they achieve competitive speeds with much lower power consumption. Also, the market is witnessing continuous advancements in these technologies. For instance, HBM 2 provides 256 Gbps of bandwidth, significantly improving over HBM 1 (128 Gbps of bandwidth).
Restraint: Thermal issues caused by high levels of integration
HMC and HBM are a stack of DRAM chips connected internally to TSVs and externally to one or more chips using micro bumps and TSV. Even though these technologies offer several advantages, thermal issues caused by the high level of integration and their impact on the overall module present a major challenge to manufacturers. These technologies offer highly dense multi-level integration per unit footprint, which creates challenges for thermal management. Listed below are some of the major complications associated with these technologies:
• The high level of integration leads to high on-chip temperatures.
• As the memory lies between the heat sink and the logic die, the heat generated from the logic die raises the temperature of the memory.
• Although the compact package offers a shorter route for a signal to travel, the heat generated in the module slows down the movement of the signal once it hits the thermal limit (to protect the circuitry)
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TOC:
Chapter 1 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Overview
1.1 Product Overview and Scope of Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)
1.2 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation By Type
1.2.1 APU
1.3 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation by End Use
1.3.1 HMC
1.3.2 HBM
TOC Continued…

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