According to the MD, top PCB manufacturers are adding value added products to the industry. The new PCBs have 1 to 24 layers and narrow tolerances with vias that are hidden or blind, high frequency, aluminum made and higher copper thickness.

More technology advancements are happening in design to improve processing services that address the latest size and power constraints, he said.

To keep up with the innovation, new generation products have high-density interconnect (HDI) with an aim to boost innovation in techniques and processes in manufacturing as a standard practice.

He said HDI processing interconnects and PCBs will be more efficient. Mainstreaming of HDI processing techniques in multilayer PCB production incorporates a higher number of smaller components and permits more signal traffic in smaller geometries.

The MD said PCB fabrication will have high-precision laser drilling for microvias to ensure dense electrical connectivity between various layers.

He said carbon dioxide lasers will be further innovated for longer wavelength in penetrating the glass fibers and for suitable modification in additional oxide treatment on copper.

Also, in making laminates, many layers of copper tracks are being used as they determine the layers needed for routing complicated circuitry.

The MD said on premium PCB manufacturing will be supplemented by a new scale in Flex and Rigid PCB prototyping. More production facilities are being opened to obtain premium quality for narrow tolerance PCBs.

The fabrication facilities will have the most current PCB production resources with inspection equipment. The full complement of fast turnaround PCB fabrication services providing will aim low run proto-type PCBs and high run PCBs.

He said the aim is to have PCB fabrication done without process defects and have adequate system for corrective actions.

Manufacturing errors will be zero and will be addressed through internal systems in areas like imaging, protective coatings, drilling, surface prep, etching chemistries, lamination, final finishes, etc.

The hardware and software in electronic devices are evolving fast and prototyping has to keep pace with the challenge to avoid costly delays during PCB development.

The MD said the next move will be to add 3D printing in the production of PCBs for saving time, costs and boost innovation.

The priority is to change standard subtractive manufacturing of PCBs that is labour intensive. The time on complex prototypes running into too many days need to be curbed.