Global Hermetic Packaging Market accounted for USD 3.11 billion in 2017 and is projected to grow at a CAGR of 6.82% during the forecast period of 2018 to 2025. The upcoming market report contains data for historic years 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.

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Market Definition:

This market report defines the market trends and forecast the upcoming opportunities and threats of the hermetic packaging market in the next 8 years. Hermetic packaging generally refer to as sealing which can be either gas tight or is resistant to gas flow. The method is originally used for the protection of MEMS devices from gas or moisture in different industries such as defense, healthcare, aerospace, and automobiles. The hermetic packaging also protects highly sensitive electronics like laser diodes, sensors, opto-electronic components, or airbag initiator propellants against corrosion, humidity, and other undesirable influences.

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Major Market Drivers and Restraints:

Growing demand from varied industry such as automobile electronics and aerospace

Increase in the adoption of hermetic packaging for the protection of highly sensitive electronic components and electronic implantable medical devices

Rising demand from ICS for myriad applications and Asia Pacific region

Stringent rules and regulation for hermetic packaging




Competitive Landscape:

The global hermetic packaging market is consolidated due to the presence of limited number of players concentrated in few countries. These major players have adopted various organic as well as inorganic growth strategies such as mergers & acquisitions, new product launches, expansions, agreements, joint ventures, partnerships, and others to strengthen their position in this market.

Major Market Competitors:

Some of the major players in global hermetic packaging market are

Texas Instruments,
Kyocera,
Ametek,
Schott AG,
Legacy Technologies,
Egide¸
Teledyne Microelectronics,
Intersil¸
Amkor,
Complete Hermetics,
SGA Technologies,
Micross Components¸
Willow Technologies,
Materion¸
SST International,
Sinclair Manufacturing Company
Among others
Market Segmentation:

The global hermetic packaging market is segmented based on configuration, type, application, industry and geographical segments.

Based on configuration, the global hermetic packaging market is segmented into multilayer ceramic packages, metal can packages and pressed ceramic packages.
On the basis of type, the global hermetic packaging market is segmented into passivation glass, glass–metal sealing, reed glass, transponder glass and ceramic metal sealing.
On the basis of application, the global hermetic packaging market is segmented into sensors, photodiodes, transistors, lasers, airbag ignitors, mems switches, oscillating crystals and others.
On the basis of industry, the global hermetic packaging market is segmented into automotive, aeronautics and space, military & defense, energy & nuclear safety, telecommunications, medical¸ consumer electronics and others. Automotive is sub segmented into airbag initiation, RFID transponder operation and battery protection.
Based on geography, the global hermetic packaging market report covers data points for 28 countries across multiple geographies such as North America, South America, Europe, Asia-Pacific and Middle East & Africa.
Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others.
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