The wired interface market is expected to reach 8.78 billion units by 2023 from 6.51 billion units in 2018, at a CAGR of 6.2% between 2018 and 2023. The said market was valued at USD 17.87 billion in 2018, and is expected to reach USD 34.72 billion by 2023, at a CAGR of 14.2% between 2018 and 2023.  Major factors driving the growth of the market include increasing use of consumer devices such as smartphone and increasing demand for wired interface due to its advantage of high data and power transfer capacity over wireless technology.

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PCs and laptops are expected to hold the largest share of the wired interface market throughout the forecast period. Most PCs and laptops are equipped with USB, HDMI, DisplayPort, and Thunderport technologies. Demand for PC and laptop is expected to decrease during the forecast period because of the increase in the use of smartphones and tablets. Furthermore, because of the high price of laptops, in developing economies, consumers are delaying buying new PCs/laptops, thus extending the lifecycle of existing PCs/laptops.

The USB Type C wired interface is expected to grow at the highest CAGR during the forecast period. USB Type C wired interface is a two-way rotational 24-pin connector, which is smaller in size and can be embedded with all possible devices. Thus, they are currently being adopted in compact devices such as smartphone, tablets and wearables.

The wired interface market in North America is expected to register the highest CAGR during the forecast period. North America is a hub for technological innovations and an early adopter of new technologies. Factors such as presence of major companies, increasing consumer spending, and growing popularity of advanced devices are driving the market in North America.  Asia Pacific accounted for the largest share of the overall market in 2017, with China being one of the major contributors in terms of market size.

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Major players in the wired interface market include Molex, Inc. (The US), Amphenol Corporation (The US), Japan Aviation Electronics Industry, Ltd. (Japan), TE Connectivity Ltd. (Switzerland), STMicroelectronics N.V. (Switzerland), NXP Semiconductors N.V. (The Netherlands), Microchip Technology Inc. (The US), Texas Instruments Inc. (The US), Cypress Semiconductor Corp. (The US), Rohm Co., Ltd. (Japan), Hirose Electric Co., Ltd. (Japan), ON Semiconductor Corporation (The US), Analog Devices Inc. (The US), Diodes Inc. (The US), Murata Manufacturing Co. Ltd. (Japan), Vishay Intertechnology, Inc. (The US), Silicon Laboratories Inc. (The US), Maxim Integrated Products, Inc. (The US), CUI, Inc. (The US), and Yamaichi Electronics Co.,Ltd. (Japan).

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