Key features of the study:

 This report provides an in-depth analysis of the global 3D ICs market and
provides market size (US$ million) and compound annual growth rate (CAGR %)
for the forecast period (2020-2027), considering 2019 as the base year.

 It elucidates potential revenue opportunities across different segments and
explains attractive investment proposition matrix for this market

 The global 3D ICs market report caters to various stakeholders in this industry
including investors, suppliers, distributors, new entrants, and financial analysts

 Stakeholders would have ease in decision-making through the various strategy
matrices used in analyzing the global 3D ICs market.


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Key Market Dynamics- Drivers

Increasing demand for efficient solutions is expected to drive growth the global
3D ICs market during the forecast period.

Furthermore, 3D ICs with TSVs provide an enhanced electrical performance due to the very high number of TSV interconnections and short interconnects within stacked ICs.

Rising adoption of portable devices is expected to propel the global 3D ICs market growth over the forecast period. 3D ICs with TSV technology allows designers to position stacks of memory chips on top of the graphics processor chip or on application microprocessors, in order to considerably reduce power consumption and enhance memory bandwidth.


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Key Market Dynamics- Restraint

1. High cost associated and testing issues are expected to restrain growth of the
global 3D ICs market during the forecast period. For instance, Xilinx, Inc. offers Virtex-7 FPGA VC709 connectivity kit with a price of around US$ 4,995.

2. Currently, there is a lack of adequate foundries and skilled professionals to manufacture 3D ICs, especially in
emerging economies such as Philippines, Brazil, Africa, and Indonesia.


Statistics:

APAC held dominant position in the global 3D ICs market in 2019, accounting
for 47.3% share in terms of value, followed by North America, Europe and RoW
respectively.


Impact of COVID-19 on 3D ICs Market

There is shortage of 3D ICs in the market caused by less production of 3D ICs. For instance, in May 2020, OPPO Company has shut down its operations in Noida as six employees test coronavirus positive.


Key players operating in the global 3D ICs market are:

Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.


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Market Segmentation:

By End-Use Sectors: Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others(Biomedical applications and R&D).

By Substrate Type: Silicon on insulator(SOI), Bulk silicon.

By Fabrication Process: Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization.

By Product: MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED.