Market Overview

The world Chip on Flex Market 2020 can be largely impacted by COVID-19 market in the years to come. MRFR study shows that the escalation of the Chip on Flex Market from USD 1437 Mn to USD 1795 Mn from 2021 top 2016 can be attributed to the rise in the sales of consumer electronics. The growth of the chip on flex market can be at 4.43% CAGR across the review period.

The high utility of Chip on flex in semiconductor sector and the rise in demand for compact devices can boost the expansion of the Chip on flex market in the years to come. The traditional replacement of conventional circuit board with chip on flex are likely to impel the expansion of the market in the years to come. The availability of shorter interconnection paths on chip on flex and the boost in designing and manufacturing to improve product performance can aid in the rise of the Chip on flex market growth. Other factors that are responsible for the chip on flex market are discussed in detail in the market across the years to come.

Market Segmentation

Segment study of the chip on flex market can aid in spotting new growth opportunities in the market and simplify the vast study of the market. The global segment study of the chip on flex market are vertical, types, and application. The type based segments of the chip-on-flex market are one sided chip on flex and double chip on flex. The application-based segments of the chip on flex market are static flexing and dynamic flexing. The dynamic flexing segment can hold the largest share of the chip-on-flex market across the forecast period. High commercial applications of dynamic flexing chip on flex can promote the rise market in the upcoming years. The vertical based segments of the chip on flex market are aerospace, electronics, military, and medical implants. The growing need for medical implants can underpin the rise of the market in the years to come.

Detailed Regional Analysis

The chip on flex market in the Asia Pacific region has high stake, as per MRFR regional study. The existence of a large number of chip producers in APAC regions can impel the expansion of the regional market. The presence of strong bureaucratic system and robust economic structure are other important causes that can promote the expansion of APAC chip on flex market across the review period. In North America, the rapid adoption of modern technologies in automobile sector can support the rise of the chip on flex market cross the assessment period. The expansion of the chip on flex market in Europe can be contributed the staggering growth rate of automobile sector and rise in primary focus on the high quality chip-on-flex components made by notable producers in the region.

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Key Players

MRFR identified some of the major players in the chip on flex market. They are; Stemko group (Korea), LGIT corporation (U.S.), Chipbond technology corporation(Taiwan), Flexceed(Japan) , Danbond technology Co. Ltd.(China), CWE(Taiwan), Compass Technology Company Limited(Hong Kong), AKM Industrial Company Ltd.(China), Stars Microelectronics Public Company Ltd. (Thailand), and Compunetics(U.S.) among others. These major players were sorted by origin of companies, their product line, innovations, and research projects. In-depth study is done on history aspect of these key players and annual revenue generated. Study of mergers and marketing strategies of these companies can also discussed in the report. In addition, the influence of COVID-19 on the chip on flex market are largely discussed in the report.

Table of Content:

6 GLOBAL CHIP ON FLEX MARKET, BY SEGMENTS

6.1 INTRODUCTION

6.2 MARKET STATISTICS

6.2.1 BY TYPE

6.2.1.1 ONE SIDED CHIP ON FLEX

6.2.1.2 OTHERS

6.2.2 BY APPLICATIONS

6.2.2.1 STATIC

6.2.2.2 DYNAMIC FLEXING

6.2.3 BY VERTICALS

6.2.3.1 MILITARY

6.2.3.2 MEDICAL

6.2.3.4 AEROSPACE

6.2.3.5 ELECTRONICS

6.2.3.6 OTHERS

6.2.4 BY GEOGRAPHY

6.2.4.1 NORTH AMERICA

6.2.4.2 EUROPE

6.2.4.3 ASIA-PACIFIC

6.2.4.4 REST OF THE WORLD

7 COMPETITIVE ANALYSIS

7.1 MARKET SHARE ANALYSIS

7.2 COMPANY PROFILES

7.2.1 LGIT CORPORATION (U.S.)

7.2.2 STEMKO GROUP (KOREA)

7.2.3 FLEXCEED (JAPAN)

7.2.4 CHIPBOND TECHNOLOGY CORPORATION (TAIWAN)

7.2.5 CWE (TAIWAN)

7.2.6 DANBOND TECHNOLOGY CO. LTD. (CHINA)

7.2.7 AKM INDUSTRIAL COMPANY LTD. (CHINA)

7.2.8 COMPASS TECHNOLOGY COMPANY LIMITED (HONG KONG)

7.2.9 COMPUNETICS (U.S.)

7.2.10 STARS MICROELECTRONICS PUBLIC COMPANY LTD (THAILAND)

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