Watsonville, CA – Nisene Technology Group, Inc., the pioneering force in integrated circuit (IC) decapsulation, announces its latest innovation, the PlasmaEtch microwave-induced plasma system. This cutting-edge technology seamlessly complements their renowned automated wet chemistry JetEtch systems, marking a significant leap forward in IC package decapping. Designed to address the evolving demands of today's advanced packaging and materials in the semiconductor industry, the PlasmaEtch system exemplifies Nisene's commitment to excellence and innovation.

For over five decades, Nisene Technology Group, Inc. has been synonymous with groundbreaking solutions in IC package decapping. The introduction of the PlasmaEtch system is a testament to the company's relentless pursuit of technological advancement. "The PlasmaEtch system is a paradigm shift in how the industry approaches IC package decapping," said a spokesperson for Nisene Technology Group, Inc. "We are proud to offer a solution that not only meets but exceeds the stringent requirements of modern semiconductor packaging."

The PlasmaEtch, a microwave-induced plasma system, offers unparalleled precision and safety in decapsulation. Unlike traditional methods, this innovative system eliminates the need for ultrasonic cleaning, reducing the risk of damaging delicate IC packages. Its introduction is timely, given the increasing complexity of semiconductor materials and the growing demand for more sophisticated decapping techniques.

Nisene Technology Group, Inc.'s journey began in the 1970s with the introduction of the Jet Etch decapsulation system. Since then, the company has evolved, introducing over 50 different types of decapsulation systems, including the latest PlasmaEtch. These advancements have not only solidified Nisene's position as a leader in the industry but have also expanded their reach beyond failure analysis to combatting counterfeit ICs.

"The PlasmaEtch system represents a significant milestone in our company's history," added the spokesperson. "It embodies our dedication to innovation and our commitment to providing the semiconductor industry with reliable, state-of-the-art decapping solutions."

As the semiconductor industry continues to evolve, Nisene Technology Group, Inc. remains steadfast in its mission to lead the way in IC package decapping. The PlasmaEtch system is a beacon of Nisene's enduring dedication to innovation, quality, and customer satisfaction.

For more information visit us: https://www.nisene.com

About Nisene Technology Group, Inc.

Founded in the 1970s, Nisene Technology Group, Inc. is a leading provider of integrated circuit decapsulation systems. Known for its JetEtch series and the revolutionary PlasmaEtch system, Nisene continues to innovate, providing solutions for IC failure analysis and protection against counterfeit ICs. Their commitment to excellence has made them a trusted name in the semiconductor industry.

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