According to a market report by Lucintel, the future of the camera modules market looks promising with opportunities in the consumer electronics, security and surveillance, automotive, industrial, and aerospace and defense industries. The camera module market is expected to grow with a CAGR of 10% from 2019 to 2024. The major drivers for this market are growing demand for camera in the consumer electronics market, enhancement in the image resolution of sensors, technological advancement in camera module components and design, and increased application of camera in automotive sector.
In this market, consumer electronics, security and surveillance, automotive, aerospace and defense, and industrial are the major application. Within the camera module market, COB (chip-on-board) camera module and flip-chip camera modules are the major process types. Flip-chip camera modules are the largest segment. APAC will remain the largest region over the forecast period.

LG Electronics, Samsung Electro-Mechanics, Sharp Corporation, Lite-On Technology, Cowell e Holdings, Sunny Optical Technology, Toshiba Corporation, Chiconey Electronics, and Foxconn Electronics are among the major manufacturers of the camera module.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the camera module market by component, process, application, and region. Lucintel has prepared a comprehensive research report entitled "Growth Opportunity in the Camera Module Market 2019-2024: Trends, Forecast, and Opportunity Analysis." This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the camera modules market by component, process, application, and region as follows :

By Component [$M shipment analysis for 2013 – 2024]:
• Image Sensor
• Lens Module
By Application [$M shipment analysis for 2013 – 2024]:
• Consumer Electronics
• Security & Surveillance
• Automotive
• Aerospace & Defense
• Industrial
By Process [$M shipment analysis for 2013 – 2024]:
• Flip-Chip
• Chip-On-Board (COB) Camera Module
By Region [$M shipment analysis for 2013 – 2024]:
• North America
– United States
– Canada
– Mexico
• Europe
– UK
– Germany
– Italy
• Asia Pacific
– China
– Japan
– India
• Rest of the World

A more than 150 pages research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at [email protected].
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:
Q.1 What are some of the most promising potential, high-growth opportunities for the camera modules market by component (image sensor and lens module), process (flip-chip and Chip on board), application (consumer electronics, security and surveillance, automotive, aerospace and defense, and industrial), region (North America, Europe, APAC, and ROW)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the camera modules market?
Q.5 What are the business risks and threats to the camera module market?
Q.6 What are emerging trends in this camera module market and the reasons behind them?
Q.7 What are of the changing demands of customers in the camera module market?
Q.8 What are the new developments in the camera module market? Which companies are leading these developments?
Q.9 Who are the major players in this camera module market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this camera module area and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities have taken place in the last 5 years in this camera module market?