With over 30 years of experience, Hybrid Tek brings decades of experience to the rapid development of integrated circuits for power and motor control, and audio and display processing. Hybrid Tek has focused on the highest standard of precision manufacture, quality and reliability all the time. They have involved rigorous testing at each stage of their projects to ensure that quality is met. With their expertise, they provide end to end services.

Hybrid Tek, specializes in advanced Integrated Circuit Assembly and Prototyping services for semiconductor companies, enabling faster time to market for new devices. The company is focused on delivering products in an efficient way, and therefore we have involved rigorous testing at each stage of the project to ensure quality. We constantly reinforce our desire to serve at the contentment of our customers. We provide a wide range of post fabrication and packaging services for semiconductor and electronics manufacturers, helping you to transit your product from wafer to usable die with faster lead time. Thus, enable you to stay competitive in market with reduced time-to- market.

Hybrid Tek are the wire bonding experts. We provide standard wire bonding services that is cost-effective and flexible for the vast majority of semiconductor packages. Our standard wire bonding services include gold ball bonding, gold wedge and aluminium wedge bonding.

We also experience with design, engineering, prototyping, assembly, automation and take our customers from concept up to and into production. Customers consistently demonstrate the viability of their new products by developing prototypes with Hybrid Tek services and processes needed for high volume manufacturing. The ability to offer high value-added assembly services like their hybrid integrated circuits, to advanced packaging is one facet of Hybrid Tek’s mission to provide cost-effective and system-efficient solutions for your component assembly needs.

We are a team of experienced personnel that focus on the research and development that specializes in various areas that can help you in your business. We specialize in many fields namely; military, mobile communications, robotics, IT manufacturing, and many others. Focusing on our customers’ requirements and the significance of time-to-market, we want to help our customers stay competitive in the semiconductor market by offering solutions that is fast in lead time and more efficient in the hybrid integrated circuits fabrication packaging services.

We understand your needs and are flexible in working with your engineering team to create the right solution to meet your expectations. Our solutions are focused on helping you to bring your products to market faster, to gain the competitive edge, and stay ahead in your industry.

To know more about the complete services that we provide, you may visit our website at www.hybrid-tek.com