Elecrtronic circuitry is unimaginable without the use of the printed circuit board (PCB). For any project, its importance is vital and thus it overrules the electronic industry. If you are looking for the assistance in the wire bonding, we will help you. We, Hybrid-Tek, provides our services in the domain of the design and layout services, printing operations, drying and firing, assembly – surface mount technology (SMT), assembly (wire bonding), potting and encapsulation, diamond sawing and dicing, inspection and quality control.

Looking for the thick film circuit board, you are at the right place. Our team is proficient in creating the functional layout. Not only that, we also create the circuit design and review out the layout. This will help in increasing the performance of the circuit along with the optimization in the manufacturability. We are an edge above the other in terms of providing the reliability and on time deliveries in our work.

We have the equipments which possess the power to conduct variety of the options. These help in performing the run of the prototype without a delay, along with the conduction of the several production jobs. These involve doing the formation of the circuit, filling up of the substrate holes, including the specialized as well as the standard coatings.

Looking for the hybrid multilayer PCB, you are at the right place. After the printing process, conduction of the two main operations, which are drying and the firing is conducted. Even we store the print screens in the screen library, to make it used in the future if the same process is required again. After it, the next step involves the circuit populating. By using the solder reflow technology, this process is conducted out. In this, mounting of the passive components and the active devices are done over the circuit. It also involves the printing of the solder paste over the circuuit pattern. Other process done are picking of the required component and placing it over its specified position.

After this the wire bonding is implemented, which involves the attachment of the semiconductor die with the surface of the substrate. Thereafter, the process of the testing and the potting and encapsulation along with the inspection and the quality control are conducted. For more information please visit- http://www.hybrid-tek.com/