Semiconductor Wafer Polishing and Grinding Equipment Market Poised for Steady Growth


Posted April 3, 2025 by miintelligence

The Semiconductor Wafer Polishing and Grinding Equipment Market is expected to register a CAGR of 4.1% during the forecast period.

 
Key Drivers of Market Growth:

Surge in Consumer Electronics: The proliferation of advanced consumer electronic devices, including smartphones, tablets, and wearable technology, necessitates the production of smaller, more efficient integrated circuits. This trend significantly boosts the demand for sophisticated wafer polishing and grinding equipment.

Miniaturization of Semiconductor Components: The industry's shift towards miniaturization, aimed at developing thinner wafers with reduced power consumption, is anticipated to propel advancements in polishing and grinding machinery.

Rise in Silicon Wafer Shipments: Global silicon wafer shipments increased by 5% in Q2 2022, reaching 3,704 million square inches, up from 3,534 million square inches in the same quarter of the previous year. This uptick reflects the growing demand for semiconductor devices and, consequently, the equipment used in their production.

Regional Insights:

North America is expected to maintain a significant share of the market, attributed to its robust semiconductor industry and continuous innovations in semiconductor packaging. The region hosts numerous wafer fabrication plants and fabless companies, including industry leaders such as Broadcom, AMD, Qualcomm, Apple, Marvell, Xilinx, and NVIDIA.

Market Challenges:

Despite the positive outlook, the market faces challenges from advancements in etching technologies, which offer certain advantages over traditional polishing methods. Additionally, the complexity of removing partial defects through conventional Chemical-Mechanical Polishing (CMP) techniques poses difficulties for manufacturers and service providers engaged in wafer reclaim activities.

Impact of COVID-19:

The COVID-19 pandemic initially disrupted semiconductor supply chains and production, particularly in China. However, the subsequent acceleration of digitalization trends has heightened the demand for semiconductor components, positively influencing the market's recovery and growth trajectory.

Competitive Landscape:

The market is moderately consolidated, featuring key players such as Applied Materials Inc., Ebara Corporation, Disco Corporation, Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.), and Revasum Inc. These companies are continually enhancing their equipment offerings to improve efficiency and meet the evolving demands of the semiconductor industry.

Recent Developments:

June 2022: Applied Materials announced the acquisition of Picosun Oy, a Finland-based semiconductor equipment company. This strategic move aims to broaden Applied Materials' ICAPS (IoT, Communications, Automotive, Power, and Sensors) product portfolio and strengthen customer engagements.

February 2022: Revasum secured a growth capital facility from SQN Venture Partners, LLC, providing up to USD 8 million in debt financing. This funding is intended to accelerate new product development and support the company's rapid growth.

The Semiconductor Wafer Polishing and Grinding Equipment Market is set for steady growth, driven by technological advancements and the increasing demand for miniaturized, efficient semiconductor components across various applications.

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Last Updated April 3, 2025