Global Advanced Packaging Market was valued US$ 3.32 Bn in 2017 and is expected to reach US$ 7.5 Bn by 2026 at a CAGR of 10.72 % during the forecast period.Global Advanced Packaging MarketThe advanced packaging industry has always been witnessing constant transitions, miniaturization of nodes and increasing size of wafers because of the ULSI fabrication are driving the market growth. An increasing number of manufacturers offering innovative products are increasing as the companies are focused on R&D. Growing consumer electronic users and consumer preference toward smaller, lighter and thinner products, with improved demand for tablets, smartphones and other connected devices, along with the growing need for advanced architecture in electronic products, are also fueling the growth of this market.
Among various industry verticals of advanced packaging, consumer electronics is likely to emerge as the largest industry vertical. By 2026 end, consumer electronics are estimated to bring in nearly US$ 15,600 million in revenue. Growing demand for various devices including tablets, smartphones, wearable devices and other connected consumer electronics, is resulting in the advanced packaging technologies. Meanwhile, System-In-Package (SIP) technology is also gaining momentum as it allows more features to be integrated into small form factors such as medical implants and wearable devices.
Asia-Pacific is expected to grow at a healthy rate, being a major revenue generating region during the forecast period, primarily because of the growing population and the customer-side demand. Prominent semiconductor industrial companies present in the region are fueling the demand for advanced packaging. Also, China is the largest growing economy with a large population, and according to statistics from China’s semiconductor association, the import of IC is increasing for the consecutive year from 2014. The Chinese government has worked on a multi-pronged strategy to support domestic IC industry development in order to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2026. This growth in the semiconductor IC industry in the region is projected to stimulate advanced packaging demand.
The advanced packaging market is being dominated by ten to fifteen major players like Intel Corporation, Samsung Electronics Co. Ltd, etc. The market is driven by end-user revenue because of the demand for the latest technology and high-speed gadgets. Sustainable competitive advantage can be attained through innovations in this market, because of the growing need for differentiated products for various applications. A positive outlook for smartphones, tablets, wireless communications, etc., will have a positive impact on this industry.
The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding dynamics, structure by analyzing the market segments by type, service, components, and region and, project the global market size. The report also provides a clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the advanced packaging market. The report also provides PEST analysis, PORTER’s analysis, SWOT analysis to address the question of shareholders in arranging the efforts and investment in the near future to a particular market segment.
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Scope of Global Advanced Packaging Market
Global Advanced Packaging Market, By Type
• 3D Integrated Circuit
• Fan Out Silicon in Package
• Fan Out Wafer Lever Package
• 3D Wafer Level Package
• Wafer Level Chip Scale Package
• 2.5D
• Flip Chip
Global Advanced Packaging Market, By Industry Vertical
• Consumer Electronics
• IT & Telecommunication
• Automotive & Transport
• Healthcare
• Aerospace & Defense
• Others
Global Advanced Packaging Market, By Region
• North America
• Europe
• Asia Pacific
• Middle East & Africa
• South America
Key players operating in Global Advanced Packaging Market
• ASE Group
• Amkor Technology
• Siliconware Precision Industries Co., Ltd. (SPIL)
• STATS ChipPAC Pte. Ltd.
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• SSS MicroTec AG.
• International Business Machines Corporation (IBM)
• Intel Corporation
• Qualcomm Technologies, Inc.
• Taiwan Semiconductor Manufacturing Company
• Advanced Semiconductor Engineering Inc.
• Chipbond Technology Corporation
• Samsung Electronics Co. Ltd
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