Market Research Hub (MRH) has actively uploaded a smart research report titled “Global IC Packaging Market Size, Status and Forecast 2019-2025”, to its broad online database. The primary motive of this study is to impart vital details associated to development of the IC Packaging Market. The assessment includes brief knowledge about market size, Y-o-Y growth, market dynamics and competitive scenario expected to transform in the near future. Ever section of the report contains imperative market data that can prove useful for new entrants and industry players to draw crucial tactics.

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IC, or integrated circuit, packaging refers literally to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the PCB. There are many different types of integrated circuits, and therefore there are different types of IC packaging to consider, as different types of circuits will have different needs when it comes to their outer shell.

In the production of semiconductor devices, IC packaging is the last stage in the process. During this stage, the semiconductor block gets covered in a package that protects the IC from potentially damaging external elements and the corrosive effects of age. The package is essentially an encasement designed to protect the block and also to promote the electrical contacts that deliver signals to the circuit board of an electronic device.

IC packaging has evolved since the 1970s, when ball grid array (BGA) packages first came into use among electronics manufacturers. At the dawn of the 21st century, newer options eclipsed pin grid array packages, namely the plastic quad flat pack and the thin small outline package. As the noughties progressed, manufacturers like Intel ushered in the era of land grid array packages.

In 2018, the global IC Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global IC Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the IC Packaging development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.

The key players covered in this study
ASE Group
Amkor
JECT
SPIL
Powertech Technology Inc
TSHT
TFME
UTAC
Chipbond
ChipMOS
KYEC
Unisem
Walton Advanced Engineering
Signetics
Hana Micron

Market segment by Type, the product can be split into
Pin-grid Array
Quad Flat Pack
Quad Flat No-Lead
Others

Market segment by Application, split into
Communication
Computing & Networking
Consumer Electronics
Others

Market segment by Regions/Countries, this report covers
North America
Europe
China
Japan
Southeast Asia
India
Central & South America

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Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global IC Packaging Market Size Growth Rate by Type (2014-2025)
1.4.2 Pin-grid Array
1.4.3 Quad Flat Pack
1.4.4 Quad Flat No-Lead
1.4.5 Others
1.5 Market by Application
1.5.1 Global IC Packaging Market Share by Application (2019-2025)
1.5.2 Communication
1.5.3 Computing & Networking
1.5.4 Consumer Electronics
1.5.5 Others
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 IC Packaging Market Size
2.2 IC Packaging Growth Trends by Regions
2.2.1 IC Packaging Market Size by Regions (2019-2025)
2.2.2 IC Packaging Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Challenges
2.3.4 Porters Five Forces Analysis

3 Market Share by Key Players
3.1 IC Packaging Market Size by by Players
3.1.1 Global IC Packaging Revenue by by Players (2014-2019)
3.1.2 Global IC Packaging Revenue Market Share by by Players (2014-2019)
3.1.3 Global IC Packaging Market Concentration Ratio (CR5 and HHI)
3.2 IC Packaging Key Players Head office and Area Served
3.3 Key Players IC Packaging Product/Solution/Service
3.4 Date of Enter into IC Packaging Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type and Application
4.1 Global IC Packaging Market Size by Type (2014-2019)
4.2 Global IC Packaging Market Size by Application (2014-2019)

5 North America
5.1 North America IC Packaging Market Size (2014-2019)
5.2 IC Packaging Key Players in North America
5.3 North America IC Packaging Market Size by Type
5.4 North America IC Packaging Market Size by Application

To be continue#@

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