primarily in the semiconductor and electronics industry as well as inactive and passive electronics. The nature of packaging is of advanced nature in comparison to the traditional packaging the way it is known. Its global cognisance is due to its ability to protect the electronics against natural elements such as harsh weather, soil moisture or sudden change in ambient atmospheric pressure that would otherwise disrupt the circuitry of delicate electronic devices. This hermetic packaging market is poised for an exponential growth primarily due to the fact that semiconductors that are highly sensitive in nature, have emerged as an integral fact of our daily lives. In view of above, it is witnessing an ever-increasing adoption in the defense, automobile, aerospace and semiconductor industry as well as due to the demand for electronics used in various commercial applications, across the globe. According to the report, the hermetic packaging market is projected to grow at a healthy CAGR over the forecast period.
The increasing cost and availability of cheaper non-hermetic packaging could be a restraint to hermetic packaging products.To this quite a few regulatory measures are being institutionalized by a few governments across the world. Fire example the government of Québec has brought about a change it in its tax incentives to woo in players so that they can establish datacentres, which undoubtedly would fuel the market for hermetic packaging.
Moreover, the Chinese market has emerged as a cornerstone for the testing and packaging of semiconductors. T0 this extent MNC around the world are increasingly striking joint venture agreements with major Chinese players to capitalize on the growing demand and future opportunities in packaging as China is looking forward to self-sufficiency on chipmaking. This the global strategies of MNC and rapid adoption in commercial space like that of food and beverage is projected to drive the market for hermetic packaging.
There are five types of ceramic metal sealing(CERTM), glass metal sealing (GTMS), passivasion glass, transponder glass, reed glass. The hermetic packaging type pertaining to ceramic metal sealing (CERTM), is estimated to witness growth due to the growing demand for CERTM sealed sensors that are increasing finding its application in chassis level sensors, differential non-contacting sensorsheating-ventilation-air conditioning (HVAC) sensors. This primarily due to the fact that the aforementioned have potential applications in the automotive industry that ensures fault-free operations and passenger safety.
As per the report, major players in hermetic packaging market are inter-alia Ametek, Amkor technology, Egide, Kyocera corporation Schott AG, Teledyne microelectronics, etc.

Segmentation:
• By Configuration
o Multilayer ceramic packages
o Metal can packages
o Pressed ceramic packages

• By Type
o Ceramic metal sealing
o Glass metal sealing
o Passivasion glass
o Transponder glass
o Reed glass

• By Application
o Transistors
o Lasers
o Photo diodes
o Airbag ignitors
o Others

• By End-Use Industry
o Military and defence
o Aeronautics and space
o Automotive
o Energy and nuclear safety
o Others

• By Geography
o North America
 USA
 Canada
 Mexico

o South America
 Brazil
 Argentina
 Others

o Europe
 Germany
 France
 United Kingdom
 Spain
 Other

The Middle East and Africa
 Saudi Arabia
 Israel
 Others

Asia Pacific
 China
 Japan
 South Korea
 India
 Others

View a sample of the report or purchase a complete study at https://www.knowledge-sourcing.com/report/hermetic-packaging-market

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