Hermetic Packaging Market Size And Forecast
According to Verified Market Research, The Global Hermetic Packaging Market was valued at USD 3,179.66 Million in 2018 and is projected to reach USD 5,248.69 Million by 2026, growing at a CAGR of 6.7% from 2016 to 2026.

The latest survey on Global Hermetic Packaging Market is conducted covering various organizations of the industry from different geographies to come up with a 100+ page report. The study is a perfect mix of qualitative and quantitative information highlighting key market developments, challenges that industry and competition are facing along with gap analysis and new opportunity available and trend in the Hermetic Packaging Market. The report aims to present the analysis of Global Hermetic Packaging Market By Configuration, By Type, By Application, By Industry, By Region – North America, Europe, South America, Asia-Pacific, Middle East, and Africa. The report intends to provide cutting-edge market intelligence and help decision makers take sound investment evaluation. Besides, the report also identifies and analyses the emerging trends along with major drivers, challenges and opportunities.

What is the Hermetic packaging?
Hermetic packaging is defined as an advanced level packaging technique which has its primary applications in passive and active electronic devices and also in the semiconductor and electronics industry. The increase in demand for electronic products is likely to drive the market over the next eight years. Technological advancements in the field of portable and smart consumer devices including smartwatches, smart televisions, and smartphones are expected to propel the utilization of the product over the forecast period. However, ongoing research to find low-cost substitutes for the product is expected to hinder the market growth.

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Hermetic packaging has been traditionally used for the protection of MEMS devices from gas or moisture in various industries including defense, healthcare, aerospace, and automobiles. Countries including Japan, the Netherlands, Germany, the U.S., Switzerland, and Canada have invested considerably in order to study the potential applications of MEMS in the military & defense sector, which is likely to positively impact the product demand. However, stringent military standards and hermetic packaging testing methods are anticipated to restrain the growth over the forecast period.

Factors influencing the Hermetic Packaging Market
Factors that are driving the growth of the market include growing demand for consumer electronics and wide applicability in packaging activities of growing sectors. In regards to the growing demand for consumer electronics; expanding middle-class, changing lifestyle preferences, growing inclination toward using smart electronic devices are among the primary factors driving the growth of the global consumer electronics market. In addition, the rising disposable income of consumers, coupled with the need for Internet usage, will propel the demand for electronic devices over the forecast period. Governments around the world are increasingly supporting digitalization, eventually promoting the usage of various electronic devices among consumers. This is anticipated to bolster the consumer electronics market on a global level.

Regarding the wide applicability in packaging activities of growing sectors, the applications of Hermetic Packaging in a variety of growing industries is another crucial driver for causing the Hermetic Packaging market to grow. Foods, pharmaceuticals, and certain chemicals require packaging that maintains a seal against flow of gases. Hermetic Packaging involves barrier packaging and vacuum packaging of food products which play a major role in the preservation of the content. Apart from Food and Beverage, Hermetic Packaging is involved in Construction and infrastructure development. Buildings designed with sustainable architecture principles use airtight technologies to conserve energy. Under low energy building, passive house, low-energy house, self-sufficient homes, zero energy building, and superinsulation standards.

A factor that is expected to hinder the growth of the Hermetic Packaging market is the existence of alternative packaging methods. In spite of making sustainable progress, Hermetic Packaging suffers a potential threat of being replaced by other substituents which are considered to be more protective and reliable. One of these alternatives is Plastic packaging. Especially in military and defense, where extreme climates are the major challenge faced by components, hermetic packaging comes out to be insufficient as a protective sealing method. Plastic packaging becomes a replacement due to its tolerance capacity in terms of external factors.

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Global Hermetic Packaging Market Analysis
The Asia Pacific Market is expected to participate heavily in the consumption of Hermetic Packaging. This position can be attributed to the booming semiconductor industry in emerging countries such as China, India, and Taiwan. The growing demand from other industry verticals such as automotive, telecommunication and military & defense has resulted in an increase in overall demand for hermetic packaging. North America is considered as the second-largest player in the market.

Global Hermetic Packaging Market Segment Analysis
The Global Hermetic Packaging market can be segmented into configuration, Type, Application, Industry, and Geography. On the basis of configuration, the market can be segmented into Multilayer Ceramic Packages, Pressed Ceramic Packages and Metal Can Packages. The market can be segmented by type into Ceramic–Metal (CERTM) Sealing, Reed Glass, Transponder Glass, Glass–Metal Sealing (GTMS), Passivation Glass. By application, the Hermetic Package can be divided into Transistors, Sensors, Lasers, Photodiodes, Airbag Ignitors, Oscillating Crystals, and MEMS Switches. By industry, the hermetic packaging market can be divided into Military & Defense, Aeronautics and Space, Automotive, Medical, Telecommunications, Consumer Electronics, Others.

Hermetic Packaging Market Competitive Landscape
Some of the major players involved in the Global Hermetic Packaging Market are Texas Instruments, Materion Corporation, Schott Ag, Ametek, Amkor Technology, Inc, Kyocera Corporation, EGIDE, Micross Components, Inc., Teledyne Technologies, Egacy Technologies, Willow Technologies Inc., Intersil Corporation, SGA Technologies Limited, SURON A.C.A Ltd, Hi-Rel Group, LLC. These companies will be profiled on the basis of their financials, their geographic and business segment breakdown, as well as product benchmarking. The competitive landscape section includes key development strategies and market ranking analysis of the above-mentioned players globally.

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