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The dissimilar material types that will be used for Hybrid multilayer PCB depend on what the application will perform, and its power requirements, environmental factors as well as other design aspects. Some common material types include FR-4, PTFE, and polyimide.
Why use dissimilar materials for hybrid PCBs?
The use of different materials for creating multilayer PCBs is to eliminate poorer structural and mechanical properties noticed in some laminates by incorporating them with the better characteristics offered by others. For instance, PTFE offers great electrical characteristics but may experience structural integrity problems at certain temperatures. To cancel this inconvenience, fabricators can consider combining polyimide into the layers as it has better mechanical properties.
Another reason for combining different materials is cutting down on costs yet acquiring the required high performance. FR-4 provides adequate advantages for low-speed applications while PTFE, on the other hand, is used for more critical functions. Moreover, FR-4 can be used to even out thickness problems for the laminate layers. It can act as the glue, holding everything together and providing an even printed circuit board.
Factors to consider while designing hybrid PCBs
While designing multiplayer PCBs that can provide all the benefits and at the same time lower the potential costs, multiple factors need to be take care of, especially when selecting materials. Each laminate has different CTE values that impart the number of dimensional alterations the material will experience due to varying temperatures. When the heat increases, a material with a high CTE ratio can expand, causing the laminate to wrap, and decompose faster.
Note
The stack-up process is another vital issue while designing the hybrid PCBs. It is important to have the proper thickness for each panel and piece. The fabricator must have good knowledge of Hybrid technology to fulfill the thickness requirements maintaining the required frequencies.

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