P & F (print & fire) technique is used to make thick film circuits, combining multi-layer screen printing of precious and semi-precious metals, and firing of precision resistors and track onto different ceramic and metal substrates. Sometimes, bare die elements and surface mount elements along with wire bonding are also incorporated, and optional complete encapsulation offers greater environmental protection. The use of variety of pastes enables to produce conductive tracks and resistors, which can be laser-trimmed to a high accuracy level, providing a proper choice of value, so no compromise in design is needed.

Introduction to thick film technology

Thick film technology incorporates the use of resistive, conductive, and insulating pastes comprising glass frit, settled in patterns identified by screen printing, fused at high temperature on a ceramic substrate. Typically, the thickness of these films ranges from 5 to 20µm, the resistivity ranges from 10Ω/square to 10MΩ/square, and there are considerable chances of building multi-layer structures.

Materials of thick films

• Substrates
• Thick film inks
• Sheet resistivity
• Conductor pastes
• Dielectric pastes
• Resistor pastes

Use of thick film

Thick film is ideal for environments that demand high level of reliability, so to withstand a wider range of temperature, having higher durability compared to conventional PCB assemblies.

Thick film technology is thoroughly used in aerospace, defence and automotive applications. Though, the reliable and durable nature of Thick film circuit board appeals to a broader market.

Thick film benefits

Ceramic substrates offer various key benefits over conventional FR4 based PCBs. One of the primary benefits is the thermal conductivity they provide. For instance, Aluminium Oxide increases thermal conductivity of around 20 times that of FR4, and Aluminium Nitride increases of around 100 times.

Another significant benefit of ceramic substrates is that they provide exponentially low thermal expansion properties, making them ideal to use in harsh environments where extreme temperatures are expected.

This amazing alliance of high thermal conductivity and low thermal expansion ensures the limitation of thermal expansion, spreading it evenly across the board, and limiting the probability that large amount of stress is exerted in particular areas.

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