Market Outlook:
The global atomic layer deposition equipment market was valued at USD 1,770.5 Million in 2019 and is projected to reach USD 3,755.3 Million by 2027, expanding at a CAGR of 10.4% during the forecast period. The atomic layer deposition (ALD) is a method that enables the deposition of thin films of a variety of materials onto any substrate. The ALD process involves a substrate surface that is exposed to alternating precursors which are not overlapping but are sequentially introduced. The ability to create thin films makes ALD essential in products such as displays, data storage devices, and small electronic components. The atomic deposition layer is used to create a protected thin film layer on any material or product, depending on the material or product which requires layer.

ALD is a key production process in the manufacture of semiconductor devices and components of a range of tools available for nanomaterial synthesis. It is identified as a key deposition method for developing thin conformal films. The demand for miniaturized and complex components combined with the advent of nano-technology drives the demand for ALD equipment. ALD equipment is generally used in the fabrication of LEDs (chroma adjustment and film-preventing Ag sulfide), electronic devices (isolation film and barrier metal), a film of gas barriers, and vapor barrier film and film-forming on complex substrates.

Market Dynamics

The market is driven by factors such as growth in industries such as electronics and semiconductor solutions, rise in the demand for electronic components in the automotive industry, increase in concerns for global warming climate change, and increasing use of component miniaturization in the electronic devices. However, high processing costs, high material waste, and high energy waste rates are key restraint of this market.

Emerging applications of ALD and recent developments in molecular precursors for ALD are increasing the adoption of ALD equipment, thus boosting the growth of the market. Recent market trends include spatial ALD for flexible electronics, 3D printed reactor for ALD, enables complex 3D nanostructures, and uniformity & conformality.

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Growing Electronics Industry and Semiconductor Solutions
Rising demand for IC products, which are made from semiconductor technology such as GPUs, CPUs, NAND flash memory, DRAM, image sensors, and power management devices, drives the demand for ALD equipment. Growth of the industries such as electronics and semiconductor solutions is expected to drive the market, particularly in Asia Pacific and North America. The growing demand in industrial applications for advanced semiconductor chips would be a positive part of the semiconductor industry growth during the forecast period. The introduction of Industry 4.0, IoT, artificial intelligence, and big data technology can enhance the manufacturing process and thus create sustainable market opportunities. The rise in the usage of smartphones and the launch of 5G technology is expected to have a positive impact on semiconductor trends during the forecast period.

Uniformity and Conformality
The independent nature of subsequent surface reactions and chemisorption of ALD enables it to grow in structures with a large depth to wide ratio to provide uniform and conformal films. The uniformed films at every corner positions along a flat surface have composed and equal thickness, for example a 300-mm wafer. ALD equipment is preferred for its uniformity and conformality features.

Segmental Outlook
On the basis of types, the atomic layer deposition equipment market is segmented into metal ALD, aluminum oxide ALD, plasma enhanced ALD, catalytic ALD, and others. The aluminum oxide ALD segment is estimated to hold a large share of the market during the forecast period due to the easy availability of aluminum and high demand for aluminum oxide films that use ALD deposition technique. The plasma-enhanced ALD segment is considered material for nanoscale memory and logic devices manufacturing due to it provides features such as thickness controllability and superior conformity; therefore the segment is anticipated to expand at high CAGR of around 10.7% during the forecast period.

Based on applications, the atomic layer deposition equipment market is categorized as research & development facilities, semiconductor & electronics, solar devices, medical equipment, and others. The semiconductor & electronics segment is projected to constitute around 62.1% share of the market by 2027 due to an increase in the sale of semiconductor-based devices and the rise in demand for miniaturized components. The solar devices segment is anticipated to expand at a CAGR of over 10.9% due to the increase in the usage of solar equipment during the forecast period.

Regional Outlook
In terms of regions, the market has been segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa (MEA). Asia Pacific is a promising region for the market. It constituted over 67.8% share of the market in 2020. The market in the region is projected to expand at a CAGR of around 10.5% during the forecast period. The demand for ALD equipment from end-use industries such as semiconductors, electronics, medical devices, and solar is expected to rise during the forecast period. The market in North America is projected to expand at a CAGR of around 10.3% due to the growth in the semiconductor industry and the consumer electronics industry in the region.

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Competitive Landscape
• Key players in the market include Tokyo Electron Limited, Applied Materials, Inc. and LAM RESEARCH CORPORATION. They considered as key manufacturers of the market based on their different varieties of product availability, regional presence, better supply chain management system, and the increasing demand for the products.
• The players are adopting key strategies such as acquisition, and geographical expansion where potential opportunity for the atomic layer deposition equipment extraction is added in the company’s capacity.
• For instance, On July 01, 2019, Applied Materials, Inc. entered into a definitive agreement to acquire all outstanding shares of Kokusai Electric Corporation, one of the leading companies providing high-productivity batch processing systems and services for memory, foundry, and logic customers.
• In November, 2017, Arradiance, LLC announced the collaboration with InRedox, a leading manufacturer of nanoporous anodic aluminum oxide (AAO) and nanotubular anodic titanium oxide (ATO). The collaboration was made for offering advanced functionalized nanostructured materials.
• On November 11, 2019, ASM International launched A400 duo vertical furnace system. It addressed 200mm applications with high productivity and low cost of ownership. The system’s DUAL Boat reactors produce high throughput, increasing reactor utilization to a very high percentage, while ensuring low capex.

Key Benefits for Industry Participants & Stakeholders
• In-depth Analysis of the Global Atomic Layer Deposition Equipment Market
• Historical, Current and Projected Market Size in terms of Value
• Potential & Niche Segments and Regions Exhibiting Promising Growth Covered
• Industry Drivers, Restraints and Opportunities Covered in the Study
• Recent Industry Trends and Developments
• Competitive Landscape & Strategies of Key Players
• Neutral Perspective on Global Atomic Layer Deposition Equipment Market Performance

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