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Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.

(Globalinforesearch) Scope of the Report:

This report focuses on the Electronic Potting & Encapsulating in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions

Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Silicones
Epoxy
Polyurethane
Others

Market Segment by Applications, can be divided into
Consumer Electronics
Automotive
Medical
Telecommunications
Others

There are 15 Chapters to deeply display the global Electronic Potting & Encapsulating market.

Chapter 1, to describe Electronic Potting & Encapsulating Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Electronic Potting & Encapsulating, with sales, revenue, and price of Electronic Potting & Encapsulating, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Electronic Potting & Encapsulating, for each region, from 2012 to 2017;

Chapter 5, 6, 7, 8 and 9, to analyze the key regions, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2012 to 2017;

Chapter 12, Electronic Potting & Encapsulating market forecast, by regions, type and application, with sales and revenue, from 2017 to 2022;

Chapter 13, 14 and 15, to describe Electronic Potting & Encapsulating sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Betty
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