The worldwide airtight bundling market size is supposed to develop from USD 3.5 billion out of 2020 to USD 4.3 billion by 2025 at a CAGR of 4.3%. The development of this market is credited to the rising utilization of airtight bundling for safeguarding exceptionally delicate electronic parts and expanding request from ventures like aviation and auto hardware.

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Key players in the hermetic packaging market include SCHOTT (Germany), AMETEK, Inc. (US), Amkor Technology, Inc. (US), Texas Instruments Incorporated (US), Teledyne Technologies (US), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), and Legacy Technologies Inc. (US). These players have adopted various growth strategies such as contracts, agreements, acquisitions, product launches, expansions, and partnerships to increase their presence in the global market.

SCHOTT (Germany)

SCHOTT is basically taken part in the turn of events and assembling of glasses and glass ceramics, specialty materials, parts, and frameworks in electronic bundling, high level optics, level glass, lighting and imaging, home tech, drug bundling, and tubing section. The organization's electronic bundling specialty unit creates and makes airtight seals and different parts for the drawn out insurance of delicate gadgets. This portion basically serves clients from an extensive variety of use showcases that incorporate car and energy, customer hardware, clinical innovation, and information and broadcast communications.

AMETEK, Inc. (US)

AMETEK manufactures electromechanical devices and electronic instruments for the global electronics and semiconductor market. AMETEK operates more than 150 facilities and 100 sales & service locations worldwide. The company’s major subsidiaries/brands include Coining Inc., Hermetic Seal Corporation (HSC), AMETEK Aegis, Sealtron, AMETEK SCP, and Glasseal Products, Inc. HSC fundamentally plans and produces airtight fixed connectors, headers, pressure bulkheads, and feedthroughs. It gives glass-to-metal-fixed interconnection gadgets to many organizations associated with the protection, aviation, atomic, geophysical, and clinical fields. Additionally, AMETEK Aegis offers glass-to-metal-seal airtight bundles (stages, modules, and flatpacks) for the microelectronic business. Sealtron fabricates round airtight fixed connectors.

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Hermetic Packaging Market with COVID-19 impact by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Region - Global Forecast to 2025

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