Chemical Mechanical Planarization Slurry Market is Projected to Grow at a CAGR of 5.03% by 2035 | ChemAnalyst


Posted April 13, 2022 by chemanalyst

Chemical Mechanical Planarization (CMP) Slurry market witnessed a demand of around 53.98 thousand tons globally in 2021 and is anticipated to grow at a significant rate with a healthy CAGR of 5.03% until 2035

 
According to ChemAnalyst report, “Chemical Mechanical Planarization (CMP) Slurry Market Analysis: Type, End Uses, Distribution Channel, Regional Demand, 2015-2035,” Chemical Mechanical Planarization (CMP) Slurry market witnessed a demand of around 53.98 thousand tons globally in 2021 and is anticipated to grow at a significant rate with a healthy CAGR of 5.03% until 2035 owing to its surging demand in Electronic Sector.

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Chemical Mechanical Planarization (CMP) Slurry are dispersions in liquid form which contain micro-abrasive grains and active compounds for chemical mechanical planarization of semiconductors and microchips. Chemical mechanical planarization is a process of polishing the surface, and it involves chemical treatment and abrasive removal. Chemical Mechanical Planarization (CMP) Slurry are formed from dispersed nanosized abrasive grains in a reactive solution. Etching through a chemical solvent softens the material, and the nanosized abrasive grains remove the material, planarizing the material's surface. The size of abrasive grains and the accumulation of particles in a slurry are the critical parameters in deciding CMP Slurry ' properties. The size of CMP abrasive particles ranges from 10nm – to 250nm.

The CMP Slurry Market is divided into the following categories based on their type, viz, Aluminium oxide, Cerium Oxide, Silica, and others. The market share of Aluminium oxide-based CMP Slurry is around 38.5% of the total demand as of 2021. A tremendous increase in demand for Chemical Mechanical Planarization (CMP) Slurry is supported by the growing demand for semiconductors and small-scale integrated circuits. Cerium oxide-based Chemical Mechanical Planarization (CMP) Slurry hold around 26.4% of the total market share as of 2021, followed by Silica based Slurry holding around 17% of the total market share in 2021.

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Among different regions, Asia Pacific holds the largest share in the Chemical Mechanical Planarization (CMP) Slurry Market followed by North America. The Asia Pacific region is likely to dominate the market in the forecast period supported by growing solar energy sector, rising demand from telecommunication industry coupled with government initiative for digitization. Asia Pacific regions holds around 56.65% of total market share of CMP Slurry Market as of 2021.

According to ChemAnalyst report, “Chemical Mechanical Planarization (CMP) Slurry Market Analysis: Type, End-User Industries, Distribution Channel, Regional Demand, 2015-2035”, Major players in the market are Cabot Microelectronics Corporation, The Dow Chemical Company, FujiFilm corporation, Fujimi Corporation, Showa Denko K.K, Eminess technologies Inc., Saint-Gobain S.A., Versum Materials Inc. and Others.

“CMP Slurry is an essential raw material for Electronic and Semiconductor industries. Moreover, CMP Slurries are also used in Solar Cells and Integrated Circuits production, making it a high demand product. Any setback to the end use industries will directly impact the demand for CMP Slurry. Owing to all these End Use sectors of CMP Slurry, a surge in its demand is anticipated to drive its market growth through the forecast period and offer several opportunities for manufacturers to expand their capacities to fill demand and supply gap in future.” said Mr. Karan Chechi, Research Director with TechSci Research, a research based global management consulting firm promoting ChemAnalyst.

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Last Updated April 13, 2022