With a predicted increase from USD 1.5 billion in 2022 to USD 1.8 billion by 2027, representing a compound annual growth rate (CAGR) of 4.0% during the forecast period, the Radiation Hardened Electronics Market is expected to grow significantly. To meet the specific needs of radiation-hardened applications, the market includes a range of components such as Memory, Power Management, Processors & Controllers, and Mixed Signal ICs. The market's resistance to problems brought on by radiation is further strengthened by a variety of production approaches, including Radiation Hardened by Design (RHBD) and Radiation Hardened by Process (RHBP). Growing applications in vital industries including aerospace, defence, and space exploration—where the dependability and durability of electronic components are crucial—are anticipated to fuel the continued expansion.

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The Radiation Hardened Electronics Market is being driven by the rapid improvements in multicore processor technology, which are specifically designed for military and space applications. Important factors driving market expansion include the growing need for electronic systems that can endure harsh nuclear conditions and the growing emphasis on intelligence, surveillance, and reconnaissance (ISR) activities worldwide. Radiation-hardened electronics are essential for vital applications in the aerospace and defence industries, where durability and dependability are crucial, as the need for strong and durable electronic components grows. This market trend highlights how essential radiation-hardened electronics are to meeting the particular difficulties presented by harsh operating conditions.

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Power electronics component to hold the largest size of radiation hardened electronics market during the forecast period

The growing use of MOSFET power electronics in space and high-reliability applications is expected to propel the power electronics component segment's dominance in the radiation-hardened electronics market over the course of the forecast period. MOSFET devices are highly robust against ionising radiation and high-energy charged particles, which makes them ideal for harsh situations. Manufacturers are working hard to improve MOSFET device performance for use in space applications. One such manufacturer is IR HiRel, a division of Infineon Technologies. In high-throughput satellite applications, for example, the Si MOSFET device from IR HiRel is intended to lower the cost per bit and increase system efficiency. This focus on innovation highlights the vital role of power electronics in creating radiation-hardened systems for crucial space and aerospace applications.

COTS in product type segment is expected to grow at the fastest CAGR during the forecast period

The radiation-hardened electronics market is expected to be dominated by the Commercial Off-The-Shelf (COTS) segment, which is expected to grow at the fastest rate (CAGR) throughout the projected period. The rapid advancement of low-cost nanosatellite technology has greatly increased the growth potential of COTS goods by leveraging their affordability. Commercial off-the-shelf (COTS) systems are being used more frequently in military space missions due to their attractive signal processing designs. Notably, by delivering pin-out compatible ceramic packaging that retain the same functionality as the original device, COTS goods offer an appealing path for cost reduction in space applications. This expedites development times, reduces risks, and enables significant cost reductions in the field of radiation-hardened electronics.

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North America expected to dominate the radiation hardened market during the forecast period

With the biggest share expected to be held during the forecast period, the radiation-hardened electronics market is led by the North American region. The increasing need for radiation-hardened components, especially for military and commercial satellite applications, is driving this leadership and expansion. Reliable radiation-hardened microelectronics are essential for the US Department of Defence (DoD) and other industries to support vital programmes including satellite missions and nuclear upgrades. Understanding the strategic significance, the US government continuously works to maintain and improve US capacity to produce radiation-hardened microelectronic components. A prominent example is the December 2021 authorization, wherein the US government deployed the Defence Production Act (DPA) Title III to enhance and fortify the domestic industrial base for radiation-hardened microelectronics.

Key players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).

News Covered:

https://www.globenewswire.com/en/news-release/2023/01/31/2598365/0/en/Global-Radiation-Hardened-Electronics-Industry-Size-is-Anticipated-to-Gain-1-8-Bn-by-2027-at-a-CAGR-of-4-0.html

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