PSM Plasma Systems is global leader plasma technology for Semiconductor, PCB, LCD and Material industries.
We PSM Inc. has rich experience and excellent staffs who have developed and commercialized various highly evaluated optimized processing techniques and practical manufacturing systems which are related to Semiconductor & Display industry, PCB & FCCL industry and other polymer industries over 10 years in the Institute for Advanced Engineering.
The atmospheric pressure plasma technique is a new advanced plasma system, which can overcome the limit of existing low-pressure vacuum plasma technique.
Atmospheric pressure plasma discharge system requires no vacuum systems and chambers, because using specially designed electrode and power sources technique, the plasma can be easily generated at 1atm (760 torr). Plasma Surface Treatment Technology
So, it could be the best solution for the company which requires continuous in-line plasma processing for mass production.
AP (Atmospheric Pressure) Plasma System:
AP (Atmospheric Pressure) Plasma System Can treat substrate automatic in-line process.
PSM NPT series AP plasma system is applicable for whole back-end line of semiconductor packaging. This NPT series provides good uniformity and process consistency.
Vacuum Plasma System:
Die attach/ Wire Bonding /molding / Ball missing of BGA package (NPT-V01, NPT-v04)
The NPT-V01 plasma system is widely used for the surface cleaning and modification process of semiconductor packaging and material treating. The demand of smaller chip size and fine pattern bring about the critical issues of semiconductor packaging.
PSM NPT-V01 plasma system has been applied the treatment of semiconductor back-end process, die attach and wire bonding, molding, ball mount. Flat Panel Display Manufacturer
Semiconductor Packaging Applications
Reliable batch type vacuum plasma system:
The NPT-V01 plasma system is widely used for the surface cleaning and modification process of semiconductor packaging and material treating.
The demand of smaller chip size and fine pattern bring about the critical issues of semiconductor packaging. PSM NPT-V01 plasma system has been applied the treatment of semiconductor back-end process, die attach and wire bonding, molding, ball mount.
The NPT-V01 plasma system provide optimized process recipe for various semiconductor processes. Reliable NPT-V01 system offers stable process and excellent uniformity using specially designed electrode, and also competitive system with easy operation and convenient maintenance.