PSM Co., Ltd. has led the development of atmospheric pressure plasma technology through constant technological innovation for the past 20 years since its establishment in 2001. That creates new high-value-added markets.
As a leader of the atmospheric plasma commercialization technology both in Korea and overseas, PSM currently possesses patents for core atmospheric plasma technologies and will continue to invest in technological innovation and quality improvement by strengthening the technology innovation group and the QC sector.
What patents PSM holds
HUMIDIFICATION APPARAUS HAVING PLASMA DISCHARGER WIH THREE DIMENSIONAL CELL STRUCTURE AND METHOD THEROF semiconductor packaging technology
APPARATUS AND METHOD FOR PLASMA FORMATION OF MICRO ARC PREVENTION TYPE
ATMOSPHERIC PRESSURE PLASMA PROCESSING APPARATUS AND ITS PROCESS
PLASMA TREATMENT APPARATUS USING DUAL FREQUENCIES ANDPLASMA TREATMENT METHOD
IN-LINE DIE CLEANING APPARATUS AND METHOD USING PLASMA
INJECTION TYPE PLASMA TREATMENT APPARATUS
PLASMA TREATMENT SYSTEM AND MLCC MANUFACTURING METHOD USING THE SAME
PLASMA GUN FOR MEDICAL TREATMENT
ROTATION DRUM TYPE PLASMA TREATING APPARATUS
FOOD POWDER STERILIZATION EQUIPMENTS USING PLASMA
PSM Atmospheric Pressure (AP) Plasma Module for Wafer Level Packaging
M-AP Plasma Series are compact in-line Atmospheric Pressure (AP) plasma modules for very efficient surface cleaning and surface modification for Wafer, Glass, Plastics, and Polymer Substrate.
Features of Wafer Level Packaging
No outgassing and no serious ESD issues in Wafer Level Packaging Process with high efficient
wafer cleaning performance.
Less failure rate than in the conventional vacuum plasma process for WLP processes.
M-AP Plasma Modules can be effectively used for cleaning & etching organic and inorganic contaminants to improve the adhesion property of the over layer on Glass and Polymer Substrates. vacuum plasma technique
General Specifications of Wafer Level Packaging
Treatment Effect: Contact Angle: < 5° at 100mm/s
Process Gap: Max. 8 mm
Process Gas: Mixed Gas (N2 + CDA), F-Gas
Low Operation Voltage: 6kV ~ 8kV
No Cooling Water (Air Cooling Only)
Gas Interlock for Safe operation
Exhaust: ~400 Pa