According to a new market research report "Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to 2022", the thin wafer market was valued USD 6.76 Billion in 2015 and estimated to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. Factors such as growth in the semiconductor industry, reduction in the size of electronic devices, growing mobile and consumer electronic markets, and high amount of material saving are key drivers for the growth of the thin wafer market. Moreover, the growing IC industry in China and high adoption of portable devices provide a huge opportunity for further growth of this market.

300mm wafer expected to lead the thin wafer market:
The 300mm wafer is widely used in the manufacturing of semiconductor devices due to its high production capacity among all other wafers. This wafer size is expected to exhibit highest growth during the forecast period. It offers the ability to manufacture a large number of devices in a single batch. This is one of the reasons companies are developing their semiconductor devices on this wafer.

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Target Audience:
• Raw Material Suppliers
• Silicon Wafer Providers
• System Integrators
• Middleware and Firmware Providers
• Semiconductor Device Manufacturers
• Suppliers and Distributors
• Government and Other Regulatory Bodies
• Research Institutes and Organizations
• Market Research and Consulting Firms

This report provides valuable insights regarding the ecosystem of this thin wafer market, such as product manufacturers and suppliers, OEMs, system integrators, suppliers and distributors, electronic device manufacturers, and semiconductor device manufacturers. This study answers several questions for stakeholders, primarily which focus on prioritizing efforts and investments in this market, in the next two to six years.

Key players operating in this thin wafer market are LG Siltronic, Inc. (South Korea), Shin-Etsu Chemical Co., (Japan), Siltronic AG (Germany), SUMCO Corporation (Japan), SunEdision Semiconductor Ltd. (U.S.), SUSS MicroTec AG (Germany), Lintec Corporation (Japan), DISCO Corporation (Japan), 3M (U.S.), Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova (Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH (Germany).

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