The performance requirements for packaging materials of LED lighting


Posted July 23, 2020 by jojo123

LED lighting packaging materials, on the one hand, should meet the requirements of the packaging process and on the other hand,

 
LED lighting packaging materials on the one hand should meet the requirements of the packaging process and on the other hand, meet the working requirements of LED. Currently, epoxy potting material accounts for a large proportion in the domestic market because the resin itself has excellent electrical insulation, adhesion, dielectric properties, transparency, and good adhesion; also the storage stable formulations and flexible operation simple. But the transparency of epoxy resin has a serious decline due to higher operating temperatures and ultraviolet radiation. It is difficult to meet the packaging requirements of a high-power LED. Many experts even believe that packaging materials and processes behind the development of the LED industry has played a bottleneck effect.

The performance requirements for packaging materials of LED lighting

In order to meet the needs of the operation process of the actual assembly of LED lighting, packaging materials should have a suitable viscosity, adhesion, and temperature resistance, including:

(1)physical characteristics before curing and general characteristics after curing. Before curing the physical properties are associated with operability, wherein the viscosity and curing properties is particularly important. Due to the impact of the high expansion rate of polymer material, after thermal curing, it will have significant shrinkage of the material after cooling, which will result in the stress on the interface with the surrounding material and occur sparking peeling phenomenon of the material cracks, so it is better to try the low-temperature curing as possible. best led headlights http://bestledheadlight.com/

(2) surface adhesion. The exposed surface of the package having an adhesive sealing material, bonded to each other causes the sealing material between this selection can not be peeled off from the machine condition causes reduced operability. Further, in use, the stick will produce dust, reduce the brightness of the case. From the peeling resistance, in terms of crack resistance, require more flexible packaging material, but in general, the higher the viscosity of a soft material, therefore, a need for a good balance between these two a material. Explosion-proof led exit signs https://www.eneltec-led.com/led-explosion-proof-lights/led-explosion-proof-exit-lights.html

(3) Lead-free reflux. Lead solder surface treatment requirements in recent years, more and more, it also shows that the heat resistance of the packaging materials has become increasingly demanding. The counter at a high temperature, the result will produce coloring caused dramatic changes in the thermal peeling, cracks, wire breakage.
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Last Updated July 23, 2020