Electronic adhesives are a part of the electronic components used in the manufacture and assembly of electronic circuits and products. They are mainly used in wire tacking, binding the surface-mount components, and encapsulating components. Raw materials used in the production of electronic adhesives include silicones, epoxies, polysulfides, polyurethanes, and cyanoacrylates.

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On the basis of geography, APAC is the leading market for electronic adhesives, due to the booming economies of China, Taiwan, India, Indonesia, and Vietnam. Epoxy resin is a preferred choice in the communications industry in APAC. It is in high demand, as it is used when extreme operating conditions require optimum protection. Epoxy also offers different physical and chemical properties from other alternatives. APAC is a rapidly developing region with growth opportunities for companies willing to invest in high-growth markets.

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Some of the key players in Electronic Adhesives Market include Dow Inc., Elkem ASA, Evonik Industries AG, BASF SE, Hitachi Chemical Co. Ltd., LG Chem Ltd., Avery Dennison Corporation, Dexerials Corp., 3M Co., Arkema SA, Covestro AG, Huntsman International LLC, H.B. Fuller Co., Henkel AG and Co. KGaA, Sika AG, Illinois Tool Works Inc., Mitsui Chemicals, Inc., and Kyocera Chemical Corporation.

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