Forecasts suggest that the Radiation Hardened Electronics Market Size will rise significantly, from USD 1.7 billion in 2024 to USD 2.1 billion in 2029. Over the course of the projection period, this growth trajectory corresponds to a 4.8% Compound Annual Growth Rate (CAGR). These observations are taken from a recent report published by reputable market research company MarketsandMarkets(TM).

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There has been a noticeable increase in the use of radiation-hardened electronics in military applications. Different electronic technologies are integrated with current platforms like drones, tanks, and fighter jets in military operations today. These systems are essential to the accomplishment of missions and must have strong resilience against disturbances brought on by radiation. The process of radiation hardening guarantees that these electronic components will function reliably even in the most demanding electromagnetic environments found in contemporary combat situations.

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

In the semiconductor industry, analogue devices are invaluable, especially when it comes to enabling the analog-to-digital conversion that microcontrollers and signal processing applications require. Furthermore, mixed-signal devices demonstrate the ability to process analogue and digital signals simultaneously. These systems offer flexibility in their implementation as they can be realised in a variety of ways, such as printed circuit boards, single IC chips, or hybrid microcircuits. Radiation hardening is necessary for these devices, especially in space and related applications, to reduce the harmful effects of radiation on digital and analogue circuits and guarantee dependable operation in challenging settings.

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Custom-made in product type segment is expected to grow at the second fastest CAGR during the forecast period.

The broad range of specialised products known as custom-made radiation-hardened electronic components is designed to satisfy the exacting requirements of radiation-rich situations. This includes discrete power transistors, fiber-optic components, microprocessors, analogue and mixed-signal processing parts, special magnetics, and a digital ASIC platform that is specifically made to withstand radiation exposure. In addition to their intrinsic radiation-hardened construction, these parts must comply with other aspects of the guidance architecture. To ensure smooth operation in radiation-intensive situations, this involves taking into account factors like mechanical shielding, module arrangement, power conditioning, and the integration of support circuits.

ROW expected to grow with second highest CAGR the radiation-hardened market during the forecast period.

The Middle East, Africa, the Gulf Cooperation Council (GCC), and South America make up the Rest of the World (RoW) market, which is expanding at a significant rate due to advances in satellite technology. The production and launch of satellites have been transformed by innovations such as tiny satellites, which have also reduced launch costs. The landscape has also been further altered by the advent of hosted satellite launches, which provide governments, academic institutions, and other organisations with frequent access to space at lower prices and faster lead times than dedicated missions. The growing need for satellite-based services in RoW countries and these technological developments will likely drive market expansion in the upcoming years.

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Radiation Hardened Electronics Companies Include:

Microchip Technology Inc.(US)
BAE Systems (UK)
Renesas Electronics Corporation (Japan)
Infineon Technologies AG (Germany)
STMicroelectronics (Switzerland), AMD (US)
Texas Instruments Incorporated (US)
Honeywell International Inc. (US)
Teledyne Technologies Inc. (US)
TTM Technologies, Inc. (US)
Cobham Limited (UK)
Analog Devices, Inc (US)
Data Devices Corporation (US)
3D Plus (France)
Mercury Systems, Inc. (US)
PCB Piezotronics, Inc (US)
Vorago (US)
Micropac Industries, Inc (US)
GSI technology, Inc (US)
Everspin Technologies Inc (US)
Semiconductor Components Industries, LLC (US)
AiTech (US)
Microelectronics Research Development Corporation (US)
Space Micro, Inc (US)
Triad Semiconductor (US).

News Covered:

https://www.prnewswire.com/news-releases/radiation-hardened-electronics-market-worth-2-1-billion-by-2029---exclusive-report-by-marketsandmarkets-302081000.html

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