Global Flip Chip Technologies Market report published by Accurize Market Research forecast that the global market is expected to reach $54 billion by 2024; growing at a CAGR of 9.2% from 2017 to 2025. By geography, Asia Pacific and North America are expected to grow at a CAGR of XX% and XX%, respectively, during the forecast period.

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High demand for miniaturization & high-performing electronic devices to drive the market

Improved performance capabilities of flip chip technology, high demand for computing, mobile-wireless, and consumer applications, and high demand for miniaturization & high-performing electronic devices are few factors boosting the growth of the global flip chip technologies market. Though, low customization options may hamper for the growth of the market. However, high demand of sensors in electronics devices would provide various growth prospects for the market in the forecast period.

Market Segmentation

Global Flip Chip Technologies Market is split into bumping technology, packaging technology, packaging type, industry vertical, and geography. The bumping technology segment is divided into copper pillar, solder bumping, gold bumping & other bumping technologies. Packaging technology segment is comprised of 3D IC, 2.5D IC and 2D IC. The market is further segmented by packaging type as flip chip SiP package, flip chip LGA package, flip chip PGA package, flip chip BGA package, and wafer level packaging–CSPnl. Industry vertical segment is divided into industrial, electronics, automotive & transport, healthcare, IT & telecommunication, aerospace and defence, and other industry verticals.

North America, Europe, Asia-Pacific and rest of the world (RoW) are the geographical segments of the market. North America is further bifurcated into countries namely; U.S., Canada and Mexico. Europe covers countries like Russia, U.K., Germany, France, Italy and Rest of Europe. Asia-Pacific countries include China, India, Japan, South Korea and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Africa and Middle East.

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"Copper pillar accounted for the largest market share in the bumping technology segment", says Accurize

Copper pillar accounted for the largest market share in 2017, in the bumping technology segment. This is due to its benefits like high efficiency & compatibility with bond pads, and noticeably low cost than other methods. 2.5D IC accounted for the largest market share in 2017, in the packaging technology segment.

"Asia-Pacific dominated the global market with the highest market share over the forecast period", says Accurize

Asia-Pacific conquered the global flip chip technologies market with largest market share of 49.3% in the year 2017. It is expected to continue its dominance during the forecasted period, due to booming market for semiconductors & electronic devices in this region.

Top players in the market

Major companies active in the market include ASE group, Samsung Electronics Co., Powertech Technology Inc., Siliconware Precision Industries Co., Ltd., United Microelectronics Corporation, Intel Corporation, Amkor Technology, Inc., TSMC, Jiangsu Changjiang Electronics Technology Co., Ltd., Texas Instruments, Inc., and Amkor Technology, Inc. among others.